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Principal Semiconductor Packaging Engineer

JR United Kingdom

High Wycombe

On-site

GBP 45,000 - 65,000

Full time

2 days ago
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Job summary

A leading company in semiconductor technology is seeking a Principal Semiconductor Packaging Engineer in High Wycombe. The successful candidate will manage the packaging roadmap, develop cutting-edge methods, and collaborate with various suppliers. Ideal for candidates with strong skills in semiconductor packaging and external communication.

Qualifications

  • Experience working with 3rd party suppliers required.
  • Knowledge of methods for thermal and mechanical performance.

Responsibilities

  • Steering the packaging roadmap for quantum processor devices.
  • Developing and supervising failure analysis experiments.

Skills

Experience of semiconductor/photonic packaging methods
Knowledge of package substrate technologies
Knowledge of die bonding methods
Strong internal and external communication skills

Job description

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Principal Semiconductor Packaging Engineer, high wycombe

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Client:

IC Resources

Location:

high wycombe, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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Created on 04/06/2025 by JR United Kingdom

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