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A leading company in semiconductor technology is seeking a Principal Semiconductor Packaging Engineer in High Wycombe. The successful candidate will manage the packaging roadmap, develop cutting-edge methods, and collaborate with various suppliers. Ideal for candidates with strong skills in semiconductor packaging and external communication.
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IC Resources
high wycombe, United Kingdom
Other
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Yes
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3
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.
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Created on 04/06/2025 by JR United Kingdom