Principal Semiconductor Packaging Engineer

JR United Kingdom; Slough; On-site; GBP 55,000 - 80,000; Full time

Job summary

A leading company in semiconductor technology is seeking a Principal Semiconductor Packaging Engineer to lead packaging development for quantum processor devices. The role involves the application of advanced packaging methods and the collaboration with both internal teams and external suppliers. Candidates should possess significant experience in semiconductor packaging and strong communication skills, ideal for steering innovative projects within a dynamic environment.

Qualifications

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies.
• Knowledge of die bonding methods for good thermal and mechanical performance.
• Experience working with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap and work with providers to develop quantum processor devices.
• Develop photonics packaging methods and ensure good thermal performance.
• Design and supervise failure analysis experiments.

Skills

Semiconductor/photonic packaging methods

Die bonding methods

Internal and external communication

Job description

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Principal Semiconductor Packaging Engineer, slough

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Client:

IC Resources

Location:

slough, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.