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Principal Semiconductor Packaging Engineer

JR United Kingdom

Bath

On-site

GBP 50,000 - 80,000

Full time

2 days ago
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Job summary

A leading client in Oxford is seeking a Principal Semiconductor Packaging Engineer to lead packaging development for quantum processors. The role includes working with various providers to innovate packaging methods, ensuring optimal thermal performance, and designing critical experiments. Strong background in semiconductor/photonic methods and excellent communication skills are essential.

Qualifications

  • Experience in semiconductor/photonic packaging.
  • Knowledge of die bonding methods for thermal performance.
  • Ability to work with suppliers and communicate effectively.

Responsibilities

  • Steer the packaging roadmap for quantum processor devices.
  • Develop wirebond and bumping methods.
  • Design and supervise failure analysis experiments.

Skills

Experience of semiconductor/photonic packaging methods
Knowledge of die bonding methods
Experience working with 3rd party suppliers
Strong communication skills

Job description

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Principal Semiconductor Packaging Engineer, bath

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Client:

IC Resources

Location:

bath, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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