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A leading client in Oxford is seeking a Principal Semiconductor Packaging Engineer to lead packaging development for quantum processors. The role includes working with various providers to innovate packaging methods, ensuring optimal thermal performance, and designing critical experiments. Strong background in semiconductor/photonic methods and excellent communication skills are essential.
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IC Resources
bath, United Kingdom
Other
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Yes
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2
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.