Enable job alerts via email!
Boost your interview chances
Create a job specific, tailored resume for higher success rate.
Une entreprise de pointe basée à Oxford recherche un Ingénieur Principal en Emballage pour diriger le développement des méthodes d'emballage de dispositifs de processeur quantique. Le candidat idéal aura de l'expérience avec les méthodes d'emballage de semi-conducteurs et devra avoir des compétences en communication solides.
Social network you want to login/join with:
col-narrow-left
IC Resources
Other
-
Yes
col-narrow-right
3
04.06.2025
19.07.2025
col-wide
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.