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Principal Semiconductor Packaging Engineer

JR United Kingdom

Basingstoke

On-site

GBP 50,000 - 80,000

Full time

Yesterday
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Job summary

Une entreprise de pointe basée à Oxford recherche un Ingénieur Principal en Emballage pour diriger le développement des méthodes d'emballage de dispositifs de processeur quantique. Le candidat idéal aura de l'expérience avec les méthodes d'emballage de semi-conducteurs et devra avoir des compétences en communication solides.

Qualifications

  • Expérience en méthodes d'emballage de semi-conducteurs et technologies de substrat d'emballage requise.
  • Connaissance des méthodes de collage de puces pour une bonne performance thermique et mécanique.

Responsibilities

  • Développer des méthodes de contact et de collage, de photoniques sur différentes fréquences.
  • Concevoir et superviser des expériences d'analyse des pannes.

Skills

Méthodes d'emballage de semi-conducteurs/photoniques
Techniques de collage de puces
Communication interne et externe

Job description

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Client:

IC Resources

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Job Category:

Other

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EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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