Principal Semiconductor Packaging Engineer

IC Resources; Oxford; On-site; GBP 50,000 - 80,000; Full time

Job summary

A leading company based in Oxford is seeking a Principal Semiconductor Packaging Engineer to guide the development of innovative packaging solutions for quantum processors. This role involves collaborating with suppliers and applying advanced methodologies in semiconductor and photonics packaging to enhance thermal performance and reliability.

Qualifications

• Experience of semiconductor/photonic packaging methods.
• Knowledge of package substrate technologies.
• Experience working with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop and produce packaging methods with good thermal performance.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics packaging knowledge

Die bonding methods

Communication skills

Job description

Principal Semiconductor Packaging Engineer

Principal Semiconductor Packaging Engineer

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Supporting a wide range of global semiconductor clients and candidates | Manufacturing, Process | Assembly, Packaging and Reliability

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.

Seniority level

• Seniority level

  Mid-Senior level

Employment type

• Employment type

  Full-time

Job function

• Job function

  Manufacturing, Engineering, and Science

• Industries

  Semiconductor Manufacturing, Nanotechnology Research, and Manufacturing

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