Principal Semiconductor Packaging Engineer

JR United Kingdom; Stevenage; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading company based in Oxford seeks a Principal Semiconductor Packaging Engineer to drive their packaging roadmap. This role involves developing cutting-edge packaging methods for quantum processors, ensuring optimal thermal performance, and collaborating with suppliers. Candidates must have extensive experience in semiconductor packaging and exceptional communication skills for successful partnership management.

Qualifications

• Experience in semiconductor/photonic packaging methods is essential.
• Knowledge of die bonding methods for thermal performance needed.
• Strong communication skills required for collaboration with suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop wirebond and bumping methods and photonics packaging methods.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics packaging

Die bonding methods

Communication skills

Job description

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Principal Semiconductor Packaging Engineer, stevenage

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Client:

IC Resources

Location:

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.