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Une entreprise de premier plan basée à Oxford recherche un Ingénieur Principal en Emballage de Semi-conducteurs pour gérer la feuille de route d'emballage. Le rôle implique le développement de méthodes de collage et d'emballage, et nécessite de bonnes compétences de communication pour travailler avec des fournisseurs internes et externes.
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IC Resources
hemel hempstead, United Kingdom
Other
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Yes
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3
04.06.2025
19.07.2025
col-wide
Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.