Principal Semiconductor Packaging Engineer

JR United Kingdom; Luton; On-site; GBP 50,000 - 80,000; Full time

Job summary

A leading company in the semiconductor industry is seeking a Principal Semiconductor Packaging Engineer to guide the packaging roadmap for quantum processor devices. The role involves developing cutting-edge packaging methods and supervising analysis experiments, requiring extensive industry experience and communication skills.

Qualifications

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies.
• Knowledge of die bonding methods for good thermal and mechanical performance.
• Strong internal and external communication skills.

Responsibilities

• Steering the packaging roadmap for quantum processor devices.
• Developing wirebond and bumping methods and packaging methods for good thermal performance.
• Designing and supervising failure analysis experiments.

Skills

Semiconductor/photonic packaging methods

Die bonding methods

Strong communication skills

Experience with 3rd party suppliers

Job description

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Principal Semiconductor Packaging Engineer, luton, bedfordshire

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Client:

IC Resources

Location:

luton, bedfordshire, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.