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A leading company seeks a Principal Semiconductor Packaging Engineer to develop packaging methods for quantum processor devices in Bedford. The role involves both technical oversight in semiconductor packaging and collaborative work with internal and external teams. Ideal candidates should have extensive experience and strong communication skills.
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IC Resources
bedford, United Kingdom
Other
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Yes
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3
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.