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Principal Semiconductor Packaging Engineer

JR United Kingdom

Bedford

On-site

GBP 50,000 - 80,000

Full time

2 days ago
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Job summary

A leading company seeks a Principal Semiconductor Packaging Engineer to develop packaging methods for quantum processor devices in Bedford. The role involves both technical oversight in semiconductor packaging and collaborative work with internal and external teams. Ideal candidates should have extensive experience and strong communication skills.

Qualifications

  • Experience of semiconductor/photonic packaging methods.
  • Knowledge of die bonding methods for thermal and mechanical performance.
  • Experience working with 3rd party suppliers.

Responsibilities

  • Steer the packaging roadmap within semiconductor packages.
  • Develop wirebond and bumping methods.
  • Supervise failure analysis experiments.

Skills

Semiconductor packaging methods
Photonics packaging methods
Package substrate technologies
Die bonding methods
Internal and external communication

Job description

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Principal Semiconductor Packaging Engineer, bedford

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Client:

IC Resources

Location:

bedford, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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