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A leading-edge company in Oxford is seeking a Principal Semiconductor Packaging Engineer to lead the packaging roadmap for quantum processor devices. This role involves developing innovative packaging solutions and collaborating with various stakeholders to ensure high-performance outcomes. Candidates should have extensive experience in semiconductor packaging and strong communication skills.
Our leading-edge Oxford-based client is seeking an experienced Packaging Engineer to lead the packaging roadmap for quantum processor devices. The role involves collaborating with internal and external providers to develop and produce advanced packaging solutions.
The key responsibilities include:
Required skills for the Principal Packaging Engineer include:
This position requires an EU work permit. For further details, please contact Rachel Anderson.