Principal Semiconductor Packaging Engineer

JR United Kingdom; Banbury; On-site; GBP 60,000 - 90,000; Full time

Job summary

A leading company in Oxford is seeking a Principal Semiconductor Packaging Engineer to spearhead their packaging initiatives for quantum devices. This role requires deep knowledge of semiconductor and photonic packaging methods, as well as strong communication skills to liaise with internal teams and external suppliers. Successful candidates will oversee the development of effective packaging solutions, focusing on thermal performance and innovative methodologies.

Qualifications

• Experience with semiconductor and photonic packaging methods.
• Knowledge of die bonding methods for thermal and mechanical performance.
• Experience working with 3rd party suppliers.

Responsibilities

• Steering the packaging roadmap for quantum processor devices.
• Developing wirebond and bumping methods.
• Designing and supervising failure analysis experiments.

Skills

semiconductor packaging methods

photonic packaging methods

die bonding methods

communication skills

Job description

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Principal Semiconductor Packaging Engineer, banbury

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Client:

IC Resources

Location:

banbury, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

4

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.