Senior Photonics Packaging Engineer (fmd)

Q.ANT; Stuttgart; Vor Ort; EUR 70.000 - 90.000; Vollzeit

Zusammenfassung

A leading photonics technology firm in Stuttgart is seeking a technical leader to develop innovative photonic packaging solutions. With over 5 years of experience, you will coordinate cross-functional teams, manage supplier partnerships, and drive innovation. The role offers the autonomy to define technical strategies and directly influence the future of AI computing solutions. Join a world-class team dedicated to revolutionary technology in a collaborative environment, shaping the future of photonic integration.

Leistungen

Collaborative work environment

Access to leadership

Autonomy and decision authority

Qualifikationen

• More than 5 years of experience in hybrid packaging, photonics assembly, or optoelectronic integration.
• Proven track record managing supplier-led R&D and packaging projects.
• Hands-on experience with PICs and laser sources.

Aufgaben

• Coordinate internal R&D and manufacturing teams for alignment on packaging solutions.
• Act as the primary point of contact for suppliers.
• Plan and oversee multi-party R&D projects.

Kenntnisse

Cross-functional leadership

Vendor Management

Laboratory Experience

Design Controls

Research Experience

Product Development

C / C++

SolidWorks

Ausbildung

Masters or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics or related field

Tools

CAD tools for photonics

Optical simulation software

Jobbeschreibung

Your mission

The future of AI computing is light not electrons. is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

What makes this role unique :

• High complexity : Developing novel high-density photonic packaging concepts that simultaneously address thermal management optical alignment RF signal integrity and manufacturability an area with few industry precedents
• Strategic freedom : Broad autonomy to define requirements select suppliers and design technical strategies within strategic goals and budgetary limits
• Decision authority : Direct influence on supplier relationships product architecture decisions and program economics

Innovation mandate : Implementation of at least one new packaging material process or architecture annually that becomes differentiating IP for the company

• Real-world impact : Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing Centre

Within your first 18-24 months you will :

• Achieve leading-edge integration density and performance through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
• Minimize integration risks and rework through rigorous supplier verification and quality assurance
• Contribute to competitive advantage by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market

Key responsibilities :

• Cross-functional leadership : Coordinate internal R&D system engineering manufacturing and test teams to align packaging solutions with overall product architecture
• Supplier engagement & interface role : Act as the primary point of contact for suppliers ensuring alignment on technical goals schedules and deliverables including contract management and negotiation
• Project control : Plan and oversee multi-party R&D projects tracking milestones budgets and risks while ensuring deliverables are verified and integrated into final systems
• Technical specification : Define complete packaging requirements including optical coupling techniques thermal management strategies RF signal integrity and hermetic sealing methods
• Quality assurance : Ensure supplier quality ratings maintain 95% on-time delivery with zero critical defects and packaging costs remain within 5% of budgeted targets

Your profile

Education & Experience :

• More than 5 years of experience in hybrid packaging photonics assembly optoelectronic integration or related high-density interconnect technologies
• Proven track record in managing supplier-led R&D and packaging projects from requirements definition through to integration and validation
• Hands‑on experience with PICs laser sources photodetectors analog electronics and mixed‑signal integration
• Masters or PhD in Photonics Optoelectronics Electrical Engineering Physics or a related field

Deep Technical Expertise in :

• Optical coupling techniques (butt‑coupling lens coupling fiber array integration)
• Thermal management strategies for high‑power photonic devices
• Understanding and enhancement of RF signal integrity for highest performance in different high density interconnects
• Packaging material science (polymers ceramics metals) and hermetic sealing methods
• Relevant standards for reliability and environmental testing (e.g. Telcordia JEDEC)

Tools & Processes :

• Familiarity with CAD tools for photonics / electronics packaging optical simulation software and statistical process control

Leadership & Coordination Skills :

• Exceptional ability to lead cross‑functional teams across R&D system engineering manufacturing and test domains
• Skilled in negotiation and contract management with external suppliers and R&D partners
• Strong systems thinking to balance optical electrical thermal and mechanical requirements simultaneously
• Excellent communication skills with the ability to translate complex technical trade‑offs to management and stakeholders

Languages :

• Fluent in English ; German or other European language beneficial

Preferred Qualifications :

• Experience with photonic integrated circuit (PIC) packaging for AI or HPC applications
• Knowledge of high‑speed digital interfaces and their integration with photonic systems
• Familiarity with scaling systems from prototype to volume production
• Understanding of supply chain management and material supplier ecosystems in photonics

Why us

• Make impact at scale : Help solve one of computings biggest challenges making growing demand in compute and sustainability go hand in hand
• Work on the leading edge : Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
• Own your work from day one : Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
• Fast‑track your growth : Work on challenges with few industry precedents every problem you solve becomes new institutional knowledge and potentially industry‑defining IP
• World‑class team : Collaborate alongside a passionate international cross‑functional team of experts in photonics processor design and AI systems
• Direct access to leadership : Work closely with the companys founders including CEO Dr. Michael Förtsch and advisory board members who shaped the semiconductor industry (ARM Intel Infineon)
• Collaborative culture : Innovative work environment that values technical excellence open communication and pragmatic problem‑solving
• Be part of history : Join at the inflection point where photonic computing transitions from research to mainstream your contributions will shape this transformation

We're looking for a technical leader who gets energized by developing novel photonic packaging solutions managing supplier partnerships and driving innovations that enable production systems to transform AI computing already today.

Ready to shape the future of photonic integration

We are looking forward to receiving your application!

is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

About us

is a photonic deep-tech scale‑up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor‑based systems. Its Light Empowered Native Arithmetics (LENA) architecture delivers analog co‑processing power optimised for complex computation and enabling energy‑efficient performance for next‑generation AI and HPC applications. operates its own Thin‑Film Lithium Niobate (TFLN) chip pilot line in collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS and is currently shipping its Native Processing Servers to selected partners. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany.

Key Skills

• Laboratory Experience
• Vendor Management
• Design Controls
• C / C++
• FDA Regulations
• Intellectual Property Law
• ISO 13485
• Research Experience
• SolidWorks
• Research & Development
• Internet Of Things
• Product Development

Employment Type : Full-Time

Experience : years

Vacancy : 1