MEMS Packaging & Modeling Expert for Implantable Devices

imec; Vlaams-Brabant; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

Imec, a world-leading nanoelectronics research center, seeks a MEMS Packaging, Integration & Modeling expert to develop next-generation packaging solutions for MEMS and implantable devices. Based at imec HQ in Leuven, you will drive packaging concepts at wafer-level, perform multi-physics modeling, and collaborate across process and design teams.

The role spans R&D to potential leadership, with opportunities to contribute to neuroprobe programs and manufacturability, translating device

Qualifications

• PhD in Mechanical Engineering, Microelectronics, Materials Engineering, Physics, or related discipline.
• Minimum 2-3 years of MEMS process integration and technology development after PhD.
• Strong expertise in finite element modeling, particularly thermal and mechanical simulations.
• Preferably, experience with neural interfaces, neuroprobes, implantable devices, or biomedical MEMS technologies.
• Experience with COMSOL, ANSYS, or similar multi-physics simulation tools is a plus.
• Knowledge of advanced interconnect technologies, hermetic packaging, and heterogeneous integration.
• Familiarity with reliability challenges associated with MEMS devices and advanced packaging.
• Strong analytical and problem-solving skills; ability to work in multidisciplinary teams.
• The position is based in imec HQ in Leuven, Belgium.

Responsabilités

• Develop and evaluate innovative MEMS packaging solutions that go beyond current industry practices.
• Lead the integration of advanced wafer-level packaging approaches for MEMS and implantable medical devices.
• Define and optimize process flows that enable reliable integration of complex MEMS structures.
• Perform thermal and mechanical finite element modeling (FEM) to assess device and package performance, reliability, and manufacturability.
• Collaborate closely with process engineers, integration engineers, design teams, and project managers to translate application requirements into robust technology solutions.
• Support customer and internal projects by providing expertise in packaging, integration, and modeling.
• Contribute to the roadmap for future neuroprobe and implantable medical device packaging and integration technologies.
• Document, communicate, and present technical results to internal and external stakeholders.

Connaissances

MEMS packaging

Multi-physics

Thermal analysis

Mechanical engineering

Team collaboration

Neural interfaces

Formation

PhD in Mechanical Engineering, Microelectronics, Materials Engineering, Physics, or related

Outils

COMSOL

ANSYS

Description du poste

Imec, a world-leading nanoelectronics research center, seeks a MEMS Packaging, Integration & Modeling expert to develop next-generation packaging solutions for MEMS and implantable devices. Based at imec HQ in Leuven, you will drive packaging concepts at wafer-level, perform multi-physics modeling, and collaborate across process and design teams.

The role spans R&D to potential leadership, with opportunities to contribute to neuroprobe programs and manufacturability, translating device