Lead, 3D Packaging Platform & Integration

imec; Vlaams-Brabant; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

IMEC seeks an experienced Platform Integration Lead for Advanced 3D Packaging in Leuven, Belgium. You will drive the 3D Packaging Integration platform across current and future IMEC fabs, coordinating process modules, test solutions and industry-standard interfaces with OSAT partners.

You will work with global teams to align PDk/ADK with industrialisation plans, present roadmaps externally, and stay at the forefront of wafer-scale 3D integration.

Qualifications

• Seasoned semiconductor technologist/engineer with >10 years in a foundry environment.
• A background in 3D/Advanced packaging wafer integration flow is essential.
• Familiarity with OSAT and interface with external partners is a plus.

Responsabilités

• Lead development of IMEC's 3D Packaging Integration platform in future fabs.
• Develop process modules, integration flow and test solutions for key blocks (Silicon Interposer, microbumps, Redistribution layers, TSVs).
• Ensure PDk/ADK alignment with industrialisation plans and manufacturing practices.
• Coordinate with OSAT and supply chain; discuss technical issues with fab teams and present roadmap externally.
• Maintain up-to-date technical knowledge and benchmark IMEC's capabilities globally.

Connaissances

Semiconductor expertise

3D packaging

ECAD/EDA familiarity

Stakeholder communication

Formation

Master's degree or PhD in a relevant field

Outils

EDA tools

Description du poste

IMEC seeks an experienced Platform Integration Lead for Advanced 3D Packaging in Leuven, Belgium. You will drive the 3D Packaging Integration platform across current and future IMEC fabs, coordinating process modules, test solutions and industry-standard interfaces with OSAT partners.

You will work with global teams to align PDk/ADK with industrialisation plans, present roadmaps externally, and stay at the forefront of wafer-scale 3D integration.