MEMS Packaging, Integration & Modeling Expert

imec; Vlaams-Brabant; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

Imec, a world-leading nanoelectronics research center, seeks a MEMS Packaging, Integration & Modeling expert to develop next-generation packaging solutions for MEMS and implantable devices. Based at imec HQ in Leuven, you will drive packaging concepts at wafer-level, perform multi-physics modeling, and collaborate across process and design teams.

The role spans R&D to potential leadership, with opportunities to contribute to neuroprobe programs and manufacturability, translating device

Qualifications

• PhD in Mechanical Engineering, Microelectronics, Materials Engineering, Physics, or related discipline.
• Minimum 2-3 years of MEMS process integration and technology development after PhD.
• Strong expertise in finite element modeling, particularly thermal and mechanical simulations.
• Preferably, experience with neural interfaces, neuroprobes, implantable devices, or biomedical MEMS technologies.
• Experience with COMSOL, ANSYS, or similar multi-physics simulation tools is a plus.
• Knowledge of advanced interconnect technologies, hermetic packaging, and heterogeneous integration.
• Familiarity with reliability challenges associated with MEMS devices and advanced packaging.
• Strong analytical and problem-solving skills; ability to work in multidisciplinary teams.
• The position is based in imec HQ in Leuven, Belgium.

Responsabilités

• Develop and evaluate innovative MEMS packaging solutions that go beyond current industry practices.
• Lead the integration of advanced wafer-level packaging approaches for MEMS and implantable medical devices.
• Define and optimize process flows that enable reliable integration of complex MEMS structures.
• Perform thermal and mechanical finite element modeling (FEM) to assess device and package performance, reliability, and manufacturability.
• Collaborate closely with process engineers, integration engineers, design teams, and project managers to translate application requirements into robust technology solutions.
• Support customer and internal projects by providing expertise in packaging, integration, and modeling.
• Contribute to the roadmap for future neuroprobe and implantable medical device packaging and integration technologies.
• Document, communicate, and present technical results to internal and external stakeholders.

Connaissances

MEMS packaging

Multi-physics

Thermal analysis

Mechanical engineering

Team collaboration

Neural interfaces

Formation

PhD in Mechanical Engineering, Microelectronics, Materials Engineering, Physics, or related

Outils

COMSOL

ANSYS

Description du poste

Engineer the next generation of MEMS and implantable medical device technology platforms through pioneering packaging and integration.

Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. By combining leadership in semiconductor process technology with expertise in software, system design, and application domains, imec develops breakthrough solutions for industries including healthcare, automotive, communications, and smart systems.

Within imec, the MOIT (MEMS and Optical Integration Technologies) department is part of TIP (Technology Integration & Prototyping). MOIT develops and integrates advanced MEMS, optical, and heterogeneous integration technologies, bridging cutting-edge research and prototype realization. The department works closely with process, equipment, characterization, design, and program teams to transform innovative concepts into manufacturable demonstrators and customer solutions.

We are looking for a MEMS Packaging, Integration & Modeling expert to develop next-generation packaging solutions for advanced MEMS devices, with a strong focus on implantable medical device applications. In this role, you will drive the exploration and development of packaging concepts beyond the current state of the art, working at the intersection of MEMS process integration, wafer-level packaging, and multi-physics modeling. A significant part of the position will support imec's neuroprobe and neurotechnology programs, translating challenging device requirements into innovative and manufacturable integration and packaging solutions.

The final level and scope of the role will be determined based on the successful candidate's background and expertise and may range from R&D Engineer to Principal Member of Technical Staff.

What you will do

• Develop and evaluate innovative MEMS packaging solutions that go beyond current industry practices.
• Lead the integration of advanced wafer-level packaging approaches for MEMS and implantable medical devices.
• Define and optimize process flows that enable reliable integration of complex MEMS structures.
• Perform thermal and mechanical finite element modeling (FEM) to assess device and package performance, reliability, and manufacturability.
• Collaborate closely with process engineers, integration engineers, design teams, and project managers to translate application requirements into robust technology solutions.
• Support customer and internal projects by providing expertise in packaging, integration, and modeling.
• Contribute to the roadmap for future neuroprobe and implantable medical device packaging and integration technologies.
• Document, communicate, and present technical results to internal and external stakeholders.

~ What Success Looks Like

• Identification and maturation of innovative packaging concepts for future MEMS and neuroprobe platforms.
• Successful integration of packaging solutions into customer and internal development programs.
• Delivery of modeling-driven insights that accelerate development and reduce technology risks.
• Recognition as a technical expert in MEMS packaging and integration within MOIT.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

You will have the opportunity to shape the future of neurotechnology and advanced MEMS systems in a highly innovative environment where breakthrough ideas can be transformed into technology platforms. You will collaborate with world-class experts in MEMS, packaging, and neural interfaces. You will have a significant technical ownership and visibility in strategic projects.

Who you are

• PhD in Mechanical Engineering, Microelectronics, Materials Engineering, Physics, or a related discipline.
• Minimum 2-3 years of MEMS process integration and technology development experience after PhD completion.
• Strong expertise in finite element modeling, particularly thermal and mechanical simulations.
• Preferably, you have experience with neural interfaces, neuroprobes, implantable devices, or biomedical MEMS technologies.
• Experience with COMSOL, ANSYS, or similar multi-physics simulation tools is a plus.
• Knowledge of advanced interconnect technologies, hermetic packaging, and heterogeneous integration.
• Familiarity with reliability challenges associated with MEMS devices and advanced packaging.
• Strong analytical and problem-solving skills.
• Ability to work effectively in multidisciplinary teams.
• The position is based in imec HQ in Leuven, Belgium.