IC Packaging Assembly Engineer — Build & Troubleshoot

imec; Vlaams-Brabant; Sur place; EUR 70 000 - 95 000; Plein temps

Avantages offerts par ce poste

Fringe benefits

Résumé du poste

IMEC in Leuven, Belgium, is seeking an experienced IC packaging engineering professional to lead and coordinate assembly projects from concept to completion. You will define scope, timelines, and deliverables while tracking progress and mitigating risks across internal teams and OSAT partners.

The role requires 5+ years in semiconductor packaging, strong knowledge of packaging technologies, and the ability to drive cross-functional collaboration across global sites.

Qualifications

• Bachelor’s or Master’s degree in a relevant engineering field is required.
• 5+ years of experience in semiconductor packaging or IC assembly engineering preferred.
• Strong understanding of packaging technologies (wire bonding, flip chip, molding, underfill & SMT).

Responsabilités

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.
• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.

Connaissances

Project management

Cross-functional coordination

Problem solving

Communication

Organizational skills

Data analysis

SPC (statistical process control)

Formation

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field

Outils

SPC software

Description du poste

IMEC in Leuven, Belgium, is seeking an experienced IC packaging engineering professional to lead and coordinate assembly projects from concept to completion. You will define scope, timelines, and deliverables while tracking progress and mitigating risks across internal teams and OSAT partners.

The role requires 5+ years in semiconductor packaging, strong knowledge of packaging technologies, and the ability to drive cross-functional collaboration across global sites.