Assembly Support Engineer

Karlstad University; Heverlee; Sur place; EUR 65 000 - 95 000; Plein temps

Résumé du poste

Imec invites an experienced packaging engineering professional to lead IC package assembly projects from concept to completion at our Leuven, Belgium HQ. You will define scopes, timelines and deliverables, track progress, and mitigate risks, acting as the main technical liaison with OSAT partners and internal teams.

You will monitor assembly activities to ensure quality, cost, and schedule adherence, while facilitating cross-site communication with vendors.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or IC assembly engineering.
• Strong understanding of packaging technologies (wire bonding, flip chip, molding, underfill & SMT).
• Experience working with OSATs and managing external suppliers.
• Knowledgeable in data analysis tools and SPC.
• Excellent problem-solving, communication, and organizational skills.

Responsabilités

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.
• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.
• Issue Resolution & Technical Support: investigate and resolve assembly-related issues including yield loss and process deviations; support root cause analysis and corrective actions.
• Documentation & Reporting: maintain detailed documentation of build processes, test results, and lessons learned; generate technical reports and present findings to stakeholders.
• Identify opportunities for process optimization and cost reduction in packaging and assembly; contribute to development of new packaging technologies and methodologies.

Connaissances

Packaging technologies

OSATs and external suppliers

Data analysis tools / SPC

Problem-solving / communication / org.

Formation

Electrical/Materials/Mechanical Engineering degree

Outils

SPC software

JEDEC/IPC knowledge

Description du poste

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.
• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.

Issue Resolution & Technical Support

• Investigate and resolve assembly-related issues including yield loss, material defects, and process deviations.
• Support root cause analysis and drive corrective actions in collaboration with quality and process engineering teams.
• Support failure analysis and reliability testing as needed.

Documentation & Reporting

• Maintain detailed documentation of build processes, test results, and lessons learned.
• Gather required documents from Assembly House like POD, substrate drawing, bonding diagram, etc.
• Generate technical reports and present findings to stakeholders and leadership.
• Identify opportunities for process optimization and cost reduction in packaging and assembly.
• Contribute to the development of new packaging technologies and methodologies.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or IC assembly engineering.
• Strong understanding of packaging technologies (e.g., wire bonding, flip chip, molding, underfill & SMT).
• Experience working with OSATs and managing external suppliers.
• Knowledgeable in data analysis tools and statistical process control (SPC).
• Excellent problem-solving, communication, and organizational skills.

Preferred Skills

• Familiarity with industry standards (JEDEC, IPC).
• Experience with advanced packaging (e.g., 2.5D/3D IC, fan-out, wafer-level packaging, BGA, etc) assembly processes.
• Knowledge on reliability testing and failure analysis techniques.
• Ability to work in a fast-paced, cross-functional environment.

Imec is the world’s trusted leader in chip-driven innovation - and a globally recognized research center at the forefront of digital technologies.