Assembly Support Engineer

imec; Vlaams-Brabant; Sur place; EUR 70 000 - 95 000; Plein temps

Avantages offerts par ce poste

Fringe benefits

Résumé du poste

IMEC in Leuven, Belgium, is seeking an experienced IC packaging engineering professional to lead and coordinate assembly projects from concept to completion. You will define scope, timelines, and deliverables while tracking progress and mitigating risks across internal teams and OSAT partners.

The role requires 5+ years in semiconductor packaging, strong knowledge of packaging technologies, and the ability to drive cross-functional collaboration across global sites.

Qualifications

• Bachelor’s or Master’s degree in a relevant engineering field is required.
• 5+ years of experience in semiconductor packaging or IC assembly engineering preferred.
• Strong understanding of packaging technologies (wire bonding, flip chip, molding, underfill & SMT).

Responsabilités

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.
• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.

Connaissances

Project management

Cross-functional coordination

Problem solving

Communication

Organizational skills

Data analysis

SPC (statistical process control)

Formation

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field

Outils

SPC software

Description du poste

• Manage and support engineering builds activities of IC package assembly projects from concept to completion.
• Define project scope, timelines, and deliverables in alignment with assembly engineering activities.
• Track progress, identify risks, and implement mitigation strategies to ensure timely execution.
• Serve as the primary technical liaison between internal teams and OSAT partners.
• Coordinate and monitor assembly activities, ensuring compliance with quality, cost, and schedule requirements.
• Facilitate communication and alignment across global manufacturing sites and vendors.

Issue Resolution & Technical Support

• Investigate and resolve assembly-related issues including yield loss, material defects, and process deviations.
• Support root cause analysis and drive corrective actions in collaboration with quality and process engineering teams.
• Support failure analysis and reliability testing as needed.

Documentation & Reporting

• Maintain detailed documentation of build processes, test results, and lessons learned.
• Gather required documents from Assembly House like POD, substrate drawing, bonding diagram, etc.
• Generate technical reports and present findings to stakeholders and leadership.
• Identify opportunities for process optimization and cost reduction in packaging and assembly.
• Contribute to the development of new packaging technologies and methodologies.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 5+ years of experience in semiconductor packaging or IC assembly engineering.
• Strong understanding of packaging technologies (e.g., wire bonding, flip chip, molding, underfill & SMT).
• Experience working with OSATs and managing external suppliers.
• Knowledgeable in data analysis tools and statistical process control (SPC).
• Excellent problem-solving, communication, and organizational skills.

Preferred Skills

• Familiarity with industry standards (JEDEC, IPC).
• Experience with advanced packaging (e.g., 2.5D/3D IC, fan-out, wafer-level packaging, BGA, etc) assembly processes.
• Knowledge on reliability testing and failure analysis techniques.
• Ability to work in a fast-paced, cross-functional environment.

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.