MEMS Packaging & Modeling Expert for Implantable Devices

Imec India Private Limited; Vlaams-Brabant; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

Imec in Leuven, Belgium, seeks a MEMS Packaging, Integration & Modeling Expert to drive advanced packaging concepts for MEMS and implantable devices. You will work at the intersection of MEMS process integration, wafer-level packaging, and multi-physics modeling, supporting neuroprobe projects and tech roadmaps.

You will collaborate with process, design, and program teams, translating device requirements into robust packaging solutions and providing modeling-driven insights.

Qualifications

• PhD in a relevant field required.
• 2–3 years MEMS process integration experience post-PhD.
• Strong multi-physics simulation capability.

Responsabilités

• Develop MEMS packaging solutions beyond current industry practice.
• Lead wafer-level packaging integration for MEMS and implantable devices.
• Define and optimize processes enabling reliable MEMS integration.
• Perform thermal and mechanical FEM to assess performance and reliability.

Formation

PhD in Mechanical Engineering / Microelectronics / Materials / Physics

Outils

COMSOL

ANSYS

Description du poste

Imec in Leuven, Belgium, seeks a MEMS Packaging, Integration & Modeling Expert to drive advanced packaging concepts for MEMS and implantable devices. You will work at the intersection of MEMS process integration, wafer-level packaging, and multi-physics modeling, supporting neuroprobe projects and tech roadmaps.

You will collaborate with process, design, and program teams, translating device requirements into robust packaging solutions and providing modeling-driven insights.