3D/2.5D Chiplet Architect for Memory Packaging

VerticalCompute; Vlaams-Brabant; Sur place; EUR 120 000 - 160 000; Plein temps

Résumé du poste

Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

You will drive architecture with multi-physics insight, perform simulations, and provide technical leadership across design, process engineering, and system teams.

Qualifications

• 5-10 years exploring 2.5D/3D packaging and heterogeneous integration.
• Translating ambitious concepts into manufacturable, high-performance designs.
• Experience with thermal, electrical, and mechanical simulations.

Responsabilités

• Integration Architecture & Process Definition: Develop architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
• Performance Analysis & Simulation: Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
• Collaboration & Communication: Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.
• Technical Leadership: Provide technical leadership and project management guidance to multidisciplinary teams.

Connaissances

3D integration

Chiplet

Interconnect strategies

Heterogeneous integration

Multi-physics simulations

Thermal analysis

Cross-functional collaboration

Project leadership

Description du poste

Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

You will drive architecture with multi-physics insight, perform simulations, and provide technical leadership across design, process engineering, and system teams.