3D Chiplet Expert

VerticalCompute; Vlaams-Brabant; Sur place; EUR 120 000 - 160 000; Plein temps

Résumé du poste

Vertical Compute is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

You will drive architecture with multi-physics insight, perform simulations, and provide technical leadership across design, process engineering, and system teams.

Qualifications

• 5-10 years exploring 2.5D/3D packaging and heterogeneous integration.
• Translating ambitious concepts into manufacturable, high-performance designs.
• Experience with thermal, electrical, and mechanical simulations.

Responsabilités

• Integration Architecture & Process Definition: Develop architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
• Performance Analysis & Simulation: Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
• Collaboration & Communication: Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.
• Technical Leadership: Provide technical leadership and project management guidance to multidisciplinary teams.

Connaissances

3D integration

Chiplet

Interconnect strategies

Heterogeneous integration

Multi-physics simulations

Thermal analysis

Cross-functional collaboration

Project leadership

Description du poste

About Us

Vertical Compute is an early-stage deep tech startup dedicated to pioneering next-generation memory technologies for advanced computing architecture. Our mission is to redefine the well-known trade-offs of semiconductor memory devices, ultimately enabling the future of computing. We are welcoming passionate, experienced, and forward-thinking colleagues to join our dynamic team and disrupt the industry together.

About What You Will Do

We are seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation.

Key Responsibilities

• Integration Architecture & Process Definition: Develop and define architectures for 2.5D/3D stacking and heterogeneous integration of VIM dies. Work with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.
• Performance Analysis & Simulation: Conduct multi-physics simulations (thermal, electrical, mechanical) to analyze and optimize the performance and reliability of integrated systems.
• Collaboration & Communication: Partner closely with design, process engineering, metrology, and system architecture teams. Participate in conferences, standardization bodies and industry events to promote or lead discussions about the future of chiplet integration.
• Technical Leadership: Provide technical leadership and project management guidance to multidisciplinary teams.

About Who You Are

• You’ve spent 5-10 years exploring the frontiers of 2.5D/3D packaging and heterogeneous integration, turning complex ideas into manufacturable systems.
• You thrive where architecture meets technology — translating ambitious concepts into elegant, high-performance designs.
• Multi-physics isn’t just theory to you; you use thermal, electrical, and mechanical simulations to see the whole system clearly.
• You’re naturally collaborative — just as comfortable in technical deep dives as you are building bridges between design, process, and system teams.
• You’re the kind of engineer who balances vision with execution: leading projects, mentoring peers, and pushing boundaries with a calm hand.
• Above all, you’re curious — drawn to the challenge of building something new and meaningful at the intersection of memory, compute, and packaging innovation.

Why Join Us

• Work at the forefront of memory technology innovation.
• Be part of a human adventure: we value curiosity, creativity, and joy in doing exceptional work.
• Collaborate with a talented and dedicated team in a fast-paced startup environment.
• Contribute to projects shaping the future of computing and electronics.
• Enjoy a motivating total rewards package.

Vertical Compute is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.