RFIC Package & High-Speed PCB Layout Engineer

ams OSRAM; Premstätten; On-site; EUR 70,000 - 110,000; Full time

Benefits offered by this job

Competitive salary

EE industry collective wage agreement

Job summary

ams OSRAM in Premstätten, Austria, seeks an experienced RF layout engineer to design high-frequency IC substrates and PCBs for sensor and mixed-signal applications. You will handle RF-aware placement, impedance-controlled routing, and drive SI/PI optimization, collaborating across EMC, analog, and IC packages to ensure successful chip-package-board integration.

Qualifications include a 6+ year background in semiconductors, expertise with Cadence Allegro, Allegro X/APD, Altium, and Virtuoso, plus

Qualifications

• Bachelor's or master's degree in a related electrical field.
• Minimum of 6 years experience in semiconductor/electronic industry.
• Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
• Experience with Cadence Virtuoso Suite and physical verification tools (Calibre/PVS) is highly desirable.
• Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts.
• Knowledge of controlled impedance routing, RF matching networks and grounding/shielding concepts.
• Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging.
• CMOS IC layout experience is desirable; good English, German is a plus.

Responsibilities

• Design and develop RF/high-frequency IC substrate and PCB layouts for sensor and mixed-signal apps.
• Perform RF-aware component placement and transmission line routing with impedance control.
• Optimize layout for SI/PI and RF performance, minimizing coupling and EMI.
• Create and maintain package substrate/PCB layouts using Cadence Allegro, Altium or Siemens PADS.
• Collaborate with EMC, analog, package and IC design engineers for chip-package-board co-design.
• Support simulations and extraction activities using SI/PI/EM extraction tools.
• Perform design verification and manufacturability reviews including DRC/ERC checks.
• Supplier selection and qualification for PCB/SMT and provide assembly support.

Skills

RF design

Signal integrity

EMI concepts

English proficiency

Education

Bachelor's or Master's Degree in Electrical Engineering or related field

Tools

Cadence Allegro Suite

Allegro X / APD / Package Designer

Altium Designer

Siemens PADS

Cadence Virtuoso Suite

Siemens Calibre

PVS

Job description

ams OSRAM in Premstätten, Austria, seeks an experienced RF layout engineer to design high-frequency IC substrates and PCBs for sensor and mixed-signal applications. You will handle RF-aware placement, impedance-controlled routing, and drive SI/PI optimization, collaborating across EMC, analog, and IC packages to ensure successful chip-package-board integration.

Qualifications include a 6+ year background in semiconductors, expertise with Cadence Allegro, Allegro X/APD, Altium, and Virtuoso, plus