IC Package / PCB Layout Engineer (d/m/f)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Premstätten; Hybrid; EUR 75.000 - 105.000; Vollzeit

Zusammenfassung

ams OSRAM AG in Premstaetten, Austria, is seeking an IC Package / PCB Layout Engineer (d/m/f) with 6+ years in the semiconductor field. You will design RF/high-frequency substrate layouts and perform SI/PI optimization, collaborating across EMC, analog, and IC teams to ensure robust integration.

Responsibilities include RF-aware placement, controlled impedance routing, and verification using Cadence/Altium tools.

Qualifikationen

• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or related field.
• Minimum 6 years experience in Semiconductor/Electronic Industry.
• Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
• Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS is highly desirable.
• Knowledge of RF/microwave passives and ESD/EMC concepts considered a strong benefit.
• Good technical English; German is beneficial.

Aufgaben

• Design and develop RF and high-frequency IC substrate and PCB layouts for sensor and mixed-signal applications.
• Perform RF-aware component placement and transmission line routing with controlled impedance structures.
• Optimize layout for SI/PI and RF performance, reducing crosstalk and EMI.
• Create and maintain package substrate and PCB layouts using Cadence Allegro Suite, Altium Designer, and/or Siemens PADS.
• Collaborate with EMC, analog, package, and IC design engineers for chip-package-board co-design and simulation support.
• Perform design verification and manufacturability reviews (DRC/ERC).
• Support supplier selection and qualification for PCB and SMT, including supply chain and assembly.

Kenntnisse

Allegro Suite

Allegro X

APD

Altium Designer

Virtuoso Suite

PVS/Calibre

Ausbildung

Bachelor's or Master’s in Electrical Engineering

Tools

Siemens Calibre

PVS (Cadence)

Jobbeschreibung

IC Package / PCB Layout Engineer (d/m/f) Language View Profile Employee Login Job Alerts Link Job Description IC Package / PCB Layout Engineer (d/m/f) Premstaetten, Austria

Sense the power of light

ams OSRAM is a global leader in innovative light and sensor solutions. “Sense the power of light” – our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

• Design and develop RF and high-frequency IC substrate and PCB layouts for sensor, and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements
• Perform RF-aware component placement and transmission line routing, including controlled impedance structures, differential pairs, coplanar waveguides (CPW), microstrip, and stripline implementations
• Optimize layout for signal integrity (SI), power integrity (PI), and RF performance, minimizing coupling, crosstalk, insertion loss, return loss, and electromagnetic interference (EMI)
• Create and maintain package substrate and PCB layouts using Cadence Allegro Suite (Allegro X, APD), Altium Designer and/or Siemens PADS including design libraries, stack-ups, and constraint management
• Collaborate with EMC, analog, package, and IC design engineers to support chip-package-board co-design and ensure successful integration of high-frequency circuits and support for simulation activities using SI/PI/EM extraction tools
• Perform design verification and manufacturability reviews, including DRC/ERC checks, fabrication rule compliance
• Supplier selection and qualification for PCB and SMT (surface mount technology), including supply chain and assembly support

Who we are looking for

• Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field
• Minimum of 6 years experience in Semiconductor/Electronic Industry
• Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer
• Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable
• Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit
• Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks
• Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging
• CMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design
• Good technical English is a must, German is beneficial

We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/) .
We offer a higher compensation depending on your expertise and skills.

Please contact Hana Krsul for further information via [e-mail] or [phone].

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.

Information at a Glance Job ID: 24093 Posting Start Date: 8/31/26 Job Family: Research & Development Career Level: Professional (> 3 years) Company: ams-OSRAM AG Schedules: Full Time Work Model: Hybrid Job Shift: Flex time Regular/Temporary: Regular Department: LSP Physical Design Local Job Grade: G

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.