RF IC Package & PCB Layout Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Premstätten; Hybrid; EUR 75,000 - 105,000; Full time

Job summary

ams OSRAM AG in Premstaetten, Austria, is seeking an IC Package / PCB Layout Engineer (d/m/f) with 6+ years in the semiconductor field. You will design RF/high-frequency substrate layouts and perform SI/PI optimization, collaborating across EMC, analog, and IC teams to ensure robust integration.

Responsibilities include RF-aware placement, controlled impedance routing, and verification using Cadence/Altium tools.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or related field.
• Minimum 6 years experience in Semiconductor/Electronic Industry.
• Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer.
• Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS is highly desirable.
• Knowledge of RF/microwave passives and ESD/EMC concepts considered a strong benefit.
• Good technical English; German is beneficial.

Responsibilities

• Design and develop RF and high-frequency IC substrate and PCB layouts for sensor and mixed-signal applications.
• Perform RF-aware component placement and transmission line routing with controlled impedance structures.
• Optimize layout for SI/PI and RF performance, reducing crosstalk and EMI.
• Create and maintain package substrate and PCB layouts using Cadence Allegro Suite, Altium Designer, and/or Siemens PADS.
• Collaborate with EMC, analog, package, and IC design engineers for chip-package-board co-design and simulation support.
• Perform design verification and manufacturability reviews (DRC/ERC).
• Support supplier selection and qualification for PCB and SMT, including supply chain and assembly.

Skills

Allegro Suite

Allegro X

APD

Altium Designer

Virtuoso Suite

PVS/Calibre

Education

Bachelor's or Master’s in Electrical Engineering

Tools

Siemens Calibre

PVS (Cadence)

Job description

ams OSRAM AG in Premstaetten, Austria, is seeking an IC Package / PCB Layout Engineer (d/m/f) with 6+ years in the semiconductor field. You will design RF/high-frequency substrate layouts and perform SI/PI optimization, collaborating across EMC, analog, and IC teams to ensure robust integration.

Responsibilities include RF-aware placement, controlled impedance routing, and verification using Cadence/Altium tools.