Package Design Engineer for 2.5D/3D Photonic Packaging

1000scholars; Villach; On-site; EUR 55,000 - 75,000; Full time

Job summary

Silicon Austria Labs in Villach, Austria, is seeking a Scientist - Package Design Engineer to advance packaging platforms and interposer technologies. You will lead R&D efforts in 2.5D/3D integration, co-design with IC/PCB, and contribute to photonic packaging initiatives.

The role requires hands-on experience in cleanroom processing, TSV/TGV fabrication, and developing ADKs. You will publish findings, write proposals, and collaborate with academic and industrial partners.

Qualifications

• MSc or PhD in Electrical Engineering or related field.
• Strong expertise in WLCSP design and IC–Package–PCB co-design.
• Hands-on experience in cleanroom processing and microfabrication workflows.
• Proven expertise in silicon or RDL interposer design and fabrication for 2.5D integration.
• Solid understanding of, and practical experience in, TSV/TGV processing.
• Experience in photonic packaging and co-packaged optics integration is highly desirable.
• Familiarity with passive and active optical alignment techniques.
• Knowledge of heterogeneous integration, chiplets and advanced packaging concepts.
• Experience of working with photonic assemblies and optical testing/characterisation.
• Strong analytical skills and a structured approach to problem solving.
• Experience in collaborative R&D projects and proposal writing.
• Fluency in English; German is a plus.

Responsibilities

• Research and development of advanced packaging platforms (2.5D and 3D).
• Design and fabrication of Si/RDL interposers for photonic-electronic integration.
• Development of assembly design kits (ADK).
• Process development and integration of TSV fabrication into interposer platforms.
• Data analysis, modeling, and process optimization.
• Lead and contribute to research projects, including publishing high-quality scientific papers or patents.
• Technical project management, acquisition in collaboration with scientific and industrial partners and coordination of development activities.
• Preparation of technical reports, scientific publications, and presentations.
• Preparation and submission of research funding proposals.

Skills

Analytical skills

Structured problem solving

Collaborative R&D

Proposal writing

English fluency

Education

MSc/PhD in Electrical Engineering or related field

Tools

Cleanroom processing

Microfabrication workflows

Photonic packaging experience

TSV/TGV processing

2.5D/3D interposer design

Job description

Silicon Austria Labs in Villach, Austria, is seeking a Scientist - Package Design Engineer to advance packaging platforms and interposer technologies. You will lead R&D efforts in 2.5D/3D integration, co-design with IC/PCB, and contribute to photonic packaging initiatives.

The role requires hands-on experience in cleanroom processing, TSV/TGV fabrication, and developing ADKs. You will publish findings, write proposals, and collaborate with academic and industrial partners.