Get more replies from employers
Send a job-specific resume in minutes.
Micron Technology, Inc in Boise, Idaho is seeking experienced Process Engineers to develop process technology for wafer bonding. Candidates should have a strong background in materials or chemical engineering and hands-on experience with wafer bonding.
The role involves process ownership, collaborating with multifunctional teams, and optimizing processes to align with DRAM roadmap requirements. Micron offers competitive benefits and values diversity in the workplace.
Micron is looking for experienced process engineers with experience in the fields of wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). As a process engineer in the Wafer Bonding team, you will be primarily responsible for developing process technology which will enable wafer bonding performance to meet the requirements for the DRAM roadmap. You will work with the process integration, process engineering, equipment, and manufacturing teams to develop and implement solutions.
Micron offers a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.