Wafer Bond Process Development Engineer

Micron Technology, Inc

Boise (ID)

On-site

USD 75,000 - 95,000

Full time

14 days+

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Benefits offered by this job

Medical, dental and vision plans
Paid family leave
Paid time-off program
Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho is seeking experienced Process Engineers to develop process technology for wafer bonding. Candidates should have a strong background in materials or chemical engineering and hands-on experience with wafer bonding.

The role involves process ownership, collaborating with multifunctional teams, and optimizing processes to align with DRAM roadmap requirements. Micron offers competitive benefits and values diversity in the workplace.

Qualifications

  • Bachelor's in a relevant field or equivalent experience.
  • 3+ years of hands-on experience in wafer bonding.
  • Knowledge of DRAM or other memory.
  • Effective communication skills.

Responsibilities

  • Developing process technology for wafer bonding.
  • Collaborating with teams to develop engineering solutions.
  • Optimizing processes to reduce costs and improve capability.
  • Managing process flow related to area equipment.

Skills

Process ownership
Problem-solving
Leadership skills
Teamwork

Education

Bachelor of Science + 3 years experience or Master of Science/PhD

Tools

Wafer bonding
Photolithography
Wet process
Thin films
Wafer thinning (grind and CMP)

Job description

Micron is looking for experienced process engineers with experience in the fields of wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). As a process engineer in the Wafer Bonding team, you will be primarily responsible for developing process technology which will enable wafer bonding performance to meet the requirements for the DRAM roadmap. You will work with the process integration, process engineering, equipment, and manufacturing teams to develop and implement solutions.

Responsibilities
  • Rigorous process ownership which includes new process development and sustaining of your current process.
  • Collaborating with Equipment teams, Process Development and Process Integration to develop innovative process engineering solutions.
  • Optimizing processes and equipment to reduce cost, process variability, and improve process capability.
  • Strong logic and problem‑solving skills and thought processes based on model‑based problem solving.
  • Mature understanding of the process flow related to area equipment, SPC principles, and recipe management.
Minimum Qualifications
  • Bachelor of Science + 3 years experience or Master of Science / PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields or relevant experience.
  • Hands‑on experience with wafer bonding.
  • Knowledge of DRAM, or other memory.
  • Ability to communicate effectively and efficiently to a variety of audiences.
Preferred Qualifications
  • Hands‑on experience with wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP).
  • Strong leadership skills with the shown ability to coordinate efforts across a variety of groups.
  • Able to efficiently organize multifunctional teams to complete projects on time.
  • Strong teamwork skills.
Benefits

Micron offers a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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