Wet Process, CMP and Bond MDE Principal Lead Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 150,000 - 190,000; Full time

Job summary

Micron Technology, Inc. is seeking a Wet Process, CMP and Bond MDE Principal Lead Engineer to drive DRAM process development and roadmap execution.

The role includes leading cross-functional teams, managing 24/7 shift operations, and mentoring engineers to build a strong talent pipeline. The ideal candidate has a Bachelor’s degree in Engineering with demonstrated leadership in semiconductor manufacturing and expertise in wet process, CMP, wafer bonding, grinding, or edge trimming.

Qualifications

• Bachelor’s degree in Engineering or equivalent experience in the semiconductor field.
• Demonstrated leadership experience in a technical or manufacturing environment.
• Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming.
• Strong problem-solving and interpersonal skills.

Responsibilities

• Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery.
• Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes.
• Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line-down recovery.
• Mentor and develop engineers, building a pipeline of talent into process development roles.
• Improve workflows, development systems, and AI adoption to enhance efficiency and decision quality.

Skills

Leadership

Mentoring

Data-driven decision making

Problem-solving

Interpersonal skills

Education

Bachelor’s degree in Engineering

Tools

AI tools

Job description

Wet Process, CMP and Bond MDE Principal Lead Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery.
• Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes.
• Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line-down recovery.
• Mentor and develop engineers, building a pipeline of talent into process development roles.
• Improve workflows, development systems, and AI adoption to enhance efficiency and decision quality.

Minimum Qualifications

• Bachelor’s degree in Engineering or equivalent experience in the semiconductor field.
• Demonstrated leadership experience in a technical or manufacturing environment.
• Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming.
• Strong problem‑solving and interpersonal skills.

Preferred Qualifications

• 5+ years of semiconductor process development experience.
• Deep expertise in one core process area and working knowledge across related areas.
• Experience in shift-based manufacturing or technology development environments.
• Proven ability to collaborate across functions and mentor emerging engineers.
• Experience leveraging AI, Generative AI, or AI‑enabled solutions to improve engineering outcomes.

Job Profile(s): Semiconductor Process Eng (Supervisory) 5

Relocation Level: TBD

Benefits

Micron offers a comprehensive benefits package, including medical, dental and vision plans, income protection, paid family leave, paid time‑off, and paid holidays.

Equal Opportunity Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.