Wet Process, CMP and Bond MDE Principal Lead Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Paid time off

Benefits guide

Job summary

Micron Technology, Inc. in Boise seeks an experienced process development leader to drive multi-functional programs accelerating DRAM technology learning and roadmap delivery.

You will mentor engineers, oversee 24/7 shift operations, and push AI-enabled optimization to improve efficiency and decision quality across the fabrication line.

Qualifications

• Bachelor’s degree in Engineering or equivalent semiconductor experience.
• Proven leadership in technical or manufacturing settings.
• Experience in wet process, CMP, wafer bonding, grinding, or edge trimming.

Responsibilities

• Lead multi-functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery
• Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes
• Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line‑down recovery
• Mentor and develop engineers, building a pipeline of talent into process development roles
• Improve workflows, development systems, and AI adoption to improve efficiency and decision quality

Skills

Leadership

Problem solving

Interpersonal skills

AI adoption

Semiconductor

Education

Bachelor's degree in Engineering

Job description

Responsibilities

• Lead multi‑functional execution of process development priorities to accelerate DRAM technology learning and roadmap delivery
• Drive wafer movement, data quality, process monitoring, and resolution of customer concerns to ensure strong development outcomes
• Lead 24/7 shift operations, including benchmarks, cycle time, tool performance, and line‑down recovery
• Mentor and develop engineers, building a pipeline of talent into process development roles
• Improve workflows, development systems, and AI adoption to improve efficiency and decision quality

Minimum Qualifications

• Bachelor’s degree in Engineering or equivalent experience in the semiconductor field
• Demonstrated leadership experience in a technical or manufacturing environment
• Experience in at least one core area: wet process, CMP, wafer bonding, grinding, or edge trimming
• Strong problem‑solving and interpersonal skills

Preferred Qualifications

• 5+ years of semiconductor process development experience
• Deep expertise in one core process area and working knowledge across related areas
• Experience in shift‑based manufacturing or technology development environments
• Proven ability to collaborate across functions and mentor emerging engineers
• Experience leveraging AI, Generative AI, or AI‑enabled solutions to improve engineering outcomes

Benefits

• Choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget
• Benefit programs that help protect income if unable to work due to illness or injury, and paid family leave
• Robust paid time‑off program and paid holidays
• Additional information regarding the benefit programs available in the Benefits Guide posted on micron.com/careers/benefits

Equal Employment Opportunity Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.