Intern - Wafer Bonding Process Development

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Retirement plan

Job summary

Micron Technology, Inc. is seeking a candidate for the Wafer Bonding team in Boise to advance wafer bonding technologies for next-generation devices. You will plan and run experiments, analyze data, document results, and communicate findings with the team.

The role emphasizes applying statistical methods and data visualization, with opportunities to use AI tools to boost productivity and process development. Collaboration across engineering disciplines is expected.

Qualifications

• Pursuing MS or PhD in a related technical field with a focus on wafer bonding or semiconductor processes.
• Understanding of wafer bonding principles and semiconductor processing applications.
• Experience with laboratory, internship, or project work in a semiconductor context.
• Strong written, verbal, and presentation skills for technical communication.

Responsibilities

• Support research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved AI and AI-enabled tools to improve productivity, accelerate learning, and support process development activities.

Skills

Statistical data analysis

Data visualization

Machine learning basics

Semiconductor processing knowledge

Research communication

Education

MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or related field

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron, our vision is to transform how the world uses information to enrich life for all. The Technology Development (R&D) organization is responsible for developing innovative memory and storage technologies that enable next-generation semiconductor products. The Wafer Bonding team focuses on advancing wafer bonding processes and equipment, driving technology acceleration, manufacturability, and performance improvements through research, experimentation, and collaboration across engineering fields.

Responsibilities

• Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Minimum Qualifications

• Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
• Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Preferred Qualifications

• Experience analyzing semiconductor process data using statistical methods and data visualization techniques.
• Knowledge of machine learning algorithms and their application to engineering or process development problems.
• Experience applying Artificial Intelligence (AI) tools or AI-Assisted workflows to enhance technical research, data analysis, or productivity.
• Proven ability to work independently and collaboratively in a dynamic, fast-paced research environment.
• Strong problem-solving skills with attention to detail and a focus on achieving outcomes.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.