Senior Process Engineering Technical Leader

Micron Technology, Inc; Boise (ID); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader focusing on chip-to-wafer and hybrid bonding. The ideal candidate will lead the development and scale-up of bonding processes for high-performance 3D memory products, collaborating across various teams to ensure repeatability and readiness for high-volume manufacturing.

Requirements include a Master’s degree or PhD in a relevant field, along with 13+ years of experience in semiconductor R&D, specifically in advanced packaging. Micron offers comprehensive benefits including medical plans and paid family leave.

Qualifications

• Minimum of 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging.
• Proven ability to lead multi-team technical efforts and drive decisions without formal authority.

Responsibilities

• Set technical direction for chip-to-wafer and hybrid bonding processes.
• Develop and mature process flows and integrations that meet performance requirements.
• Drive technology transfer into manufacturing with a focus on high-volume readiness.

Skills

Technical leadership

Chip-to-wafer bonding

Problem-solving

Process integration

Education

Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here!

This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost.

Responsibilities

• Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs
• Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs
• Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions
• Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs
• Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness

Minimum Qualifications

• Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field
• 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging
• Proven ability to lead multi‑team technical efforts and drive decisions without formal authority

Preferred Qualifications

• Experience leading FOAK process or equipment development under technical uncertainty
• Hands‑on work with equipment and materials suppliers shaping next‑generation capabilities
• Demonstrated technical leadership through mentoring, methodology development, patents, or publications
• Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding
• Strong understanding of process and package integration and cross‑module interactions

Benefits

Micron offers a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.