Staff / Principal Wafer Bond Process Development Engineer

Micron Technology; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Health programs

Savings programs

Stock purchase discount

Time off program

Job summary

Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho to advance next-generation DRAM bonding. You will lead development, plan experiments, and collaborate with cross-functional teams to improve yield, cost, and reliability while applying AI/ML tools to complex problems.

You will contribute to process technology from development to manufacturing, tackling line challenges and qualifying new equipment and materials for high-volume production.

Qualifications

• PhD with 3+ years, MS with 5+ years, or BS with 7+ years in semiconductor industry.
• 5+ years developing and driving wafer bonding technologies or related processes.
• Hands-on experience with direct bonding, hybrid bonding, wafer thinning, or de-bonding.
• Strong analytical and problem-solving skills with data-driven decision making.
• Ability to lead projects across cross-functional teams and deliver results.
• Experience improving quality, reliability, yield, cost, and manufacturing readiness.

Responsibilities

• Develop and optimize wafer bonding processes for next-generation DRAM.
• Plan and execute DOEs to improve process performance and reliability.
• Drive yield improvement, cost reduction, and productivity using data-driven methods.
• Evaluate and qualify new equipment, materials, and process technologies.
• Collaborate with manufacturing and suppliers to implement improvements.
• Apply AI/ML/LLM tools to boost efficiency and problem solving.

Skills

Analytical skills

Problem-solving

Cross-functional collaboration

Data-driven decisions

Education

PhD

Master's degree

Bachelor's degree

Tools

Direct bonding

Hybrid bonding

Wafer thinning

De-bonding

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control. You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations.

Responsibilities Include, But Not Limited To

• Develop and optimize wafer bonding processes to enable next-generation DRAM technologies.
• Plan and execute experiments (DOEs) to improve process performance, product quality, and reliability.
• Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving.
• Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing.
• Collaborate with manufacturing, suppliers, and cross-functional teams to resolve issues and implement process improvements.
• Use advanced analytics, AI/ML tools, and technical expertise to solve complex problems and accelerate innovation.

Minimum Requirements

• PhD with 3+ years, Master's degree with 5+ years, or Bachelor's degree with 7+ years of relevant semiconductor industry experience.
• 5+ years of experience developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes.
• Hands-on experience with one or more of the following: direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies.
• Strong analytical and problem-solving skills with a demonstrated ability to lead complex technical challenges, drive innovation, and deliver process improvements through data-driven decisions.
• Proven ability to work effectively across cross-functional teams while independently leading projects, influencing technical direction, and delivering results.
• Experience developing and optimizing semiconductor processes to improve quality, reliability, yield, cost, and manufacturing readiness.

Preferred Requirements

• Experience supporting DRAM, memory, or advanced semiconductor technology development.
• Knowledge of process characterization, statistical analysis, DOE methodology, and root-cause investigation techniques.
• Experience qualifying new equipment, materials, and process technologies for high-volume manufacturing.
• Familiarity with supplier collaboration and technology transfer activities.
• Experience using AI, machine learning, or large language models (LLMs) to improve engineering productivity and accelerate problem solving.
• Strong written, verbal, and presentation communication skills.

Location

• Boise, Idaho

Benefits

• Health, Savings, Wellbeing Programs, Stock Purchase Discount, and a generous Time Off Program.

Additional Benefits

• medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• benefit programs that help protect your income if you are unable to work due to illness or injury.
• paid family leave.
• robust paid time-off program and paid holidays.
• Benefit Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.