Thermal Systems Engineer - 3D Semiconductor Packaging

Acceler8 Talent; Massachusetts; On-site; USD 120,000 - 170,000; Full time

Job summary

Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer for an early-stage semiconductor company developing a multi-material 3D integration platform. You design, simulate and validate thermal and mechanical performance in dense packages to enable higher density and reliability.

You will translate models into design choices, work with packaging, electrical and reliability engineers, and drive hardware validation from concept to working hardware in a small, fast-moving team.

Qualifications

• Deep ownership of thermal or thermo-mechanical engineering in constrained hardware (semiconductor packaging, etc).
• Hands-on FEA or multiphysics experience with real hardware impact.
• Experience moving from simulation to physical testing and iteration.
• Ability to explain modelling assumptions, boundary conditions and validation methods.
• Understanding of how materials, interfaces and package construction affect thermal/mechanical behaviour.
• Ability to work across materials, mechanical, packaging and electrical disciplines.
• Willingness to take broad technical ownership in a small, evolving team.

Responsibilities

• Model thermal and thermo-mechanical behaviour in high-density semiconductor packages and 3D systems.
• Translate simulation results into decisions about package architecture, materials, interfaces and cooling.
• Collaborate with electrical, packaging and reliability engineers to resolve coupled system trade-offs.
• Carry analysis through implementation, testing and design iteration.
• Validate predictions against measured hardware, investigate discrepancies and feed findings into the next design.
• Help establish thermal-design and validation practices within a founding-stage semiconductor team.

Skills

Thermal engineering

Thermo-mechanical

FEM / Multiphysics

Physical testing

System integration

Cross-functional collaboration

Small-team ownership

Tools

ANSYS / COMSOL

Job description

Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer for an early-stage semiconductor company developing a multi-material 3D integration platform. You design, simulate and validate thermal and mechanical performance in dense packages to enable higher density and reliability.

You will translate models into design choices, work with packaging, electrical and reliability engineers, and drive hardware validation from concept to working hardware in a small, fast-moving team.