Lead Mechanical Simulation Engineer – Packaging

SK hynix America; San Jose (CA); On-site; USD 105,000 - 160,000; Full time

Benefits offered by this job

Top-tier health insurance

Paid time off

401k matching

FSA benefits

Educational reimbursement

Donation matching

Free meals

Job summary

SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. You will drive the mechanical integrity of next‑generation packaging solutions (HBM, 2.5D/3D integration) using advanced numerical methods to predict thermo‑mechanical behavior in complex IC packages.

Collaborate with design and process teams to optimize warpage, solder joint reliability, and interfacial adhesion, and map system‑level interactions to board and

Qualifications

• Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
• Solid mechanics, heat transfer, and strength of materials applicable to semiconductor packaging.
• Experience with commercial FEA software (ABAQUS preferred, ANSYS Mechanical or LS-DYNA).

Responsibilities

• Develop high-fidelity, non-linear FEA models to characterize stress, strain, and warpage in advanced packages.
• Perform thermo-mechanical multi-physics simulations to evaluate thermal gradients on structural integrity and fatigue life.
• Collaborate with designers and process engineers to optimize warpage, solder joint reliability, and interfacial adhesion.
• Define material constitutive models for EMC, Substrate, Silicon, TIM and correlate with empirical data.
• Predict potential failure modes and develop mitigation strategies to meet reliability standards.
• Establish standardized simulation workflows, meshing techniques, and automation scripts to improve accuracy and throughput.
• Present findings to internal stakeholders and global R&D teams to influence roadmaps and specs.

Skills

FEA modeling

Multi-physics

ABAQUS

ANSYS Mechanical

LS-DYNA

Python scripting

Semiconductor packaging

Thermo-mechanics

Rack systems

DOE analysis

Education

Master's degree in Mechanical Engineering or Materials Science

Tools

ABAQUS

ANSYS Mechanical

LS-DYNA

Job description

SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. You will drive the mechanical integrity of next‑generation packaging solutions (HBM, 2.5D/3D integration) using advanced numerical methods to predict thermo‑mechanical behavior in complex IC packages.

Collaborate with design and process teams to optimize warpage, solder joint reliability, and interfacial adhesion, and map system‑level interactions to board and