Advanced Semiconductor Packaging Technician

Intel Corporation

Chandler (AZ)

On-site

USD 52,000 - 100,000

Full time

7 days ago

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Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Engineering Technician to support advanced packaging technology development in a fully on-site role. You will prepare samples, run analyses, and generate high-quality data to drive semiconductor process optimization and failure analysis.

Working with research engineers, you will characterize materials, operate SEM/EDS and CSAM/TSAM, perform sample preparation, and help ensure safety, quality, and documentation standards in a

Qualifications

Associate or bachelor's in STEM; or HS diploma with 1+ year material characterization experience.
Experience with materials characterization, sample preparation, or failure analysis is a plus.
Strong analytical and documentation skills required.

Responsibilities

Perform materials characterization and analysis using microscopy and related techniques.
Prepare samples/coupons for testing and cross-sectioning, polishing, etching, and ion milling.
Operate SEM/EDS, CSAM/TSAM, optical microscopy and mechanical test systems.
Support material evaluations, process development, and failure analysis investigations.
Document and communicate results while maintaining safety and quality standards.

Skills

Analytical thinking

Collaborative communicator

Attention to detail

Growth mindset

Education

Associate or Bachelor's in STEM

High School Diploma + 1+ year experience

Tools

SEM/EDS

CSAM/TSAM

Optical microscopy

Mechanical testing systems

Job description

Working with research engineers, you will characterize materials, operate SEM/EDS and CSAM/TSAM, perform sample preparation, and help ensure safety, quality, and documentation standards in a

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