Senior Director, Technical Business Development - 3DIC & Advanced Packaging

Siemens EDA (Siemens Digital Industries Software)

Boulder (CO)

On-site

USD 274,700 - 549,400

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Siemens EDA (Siemens Digital Industries Software) in Boulder, Colorado is looking for a proven leader to spearhead the Technology Solutions Sales organization for 3DIC and Advanced Packaging. This strategic role involves driving growth and building collaborative approaches across Sales and Technical Sales teams.

The ideal candidate will possess a Bachelor's degree in Electrical Engineering or Computer Science, with over 12 years of experience in EDA or semiconductor design. A strong knowledge of 3DIC is preferred, along with excellent communication and negotiation skills.

The position requires 30%+ travel, making it essential for candidates to be located near a major airport in North America.

Qualifications

  • 12+ years' experience in EDA, semiconductor design, or electronics industries.
  • Deep knowledge of 3DIC and advanced packaging.

Responsibilities

  • Lead the strategy to identify and close new business opportunities in 3DIC.
  • Build repeatable approaches for opportunity development.
  • Collaborate with Sales, Technical Sales, and R&D teams.

Skills

Leadership
Sales Strategy
Negotiation
Collaborative Momentum
Prospecting

Education

Bachelor's degree in Electrical Engineering or Computer Science

Job description

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effective. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Siemens Digital Industries Software seeks a proven and motivated individual to lead the Technology Solutions Sales organization for 3DIC and Advanced Packaging. 3DIC is one of the most strategically important and fast-moving areas in the semiconductor industry. Siemens has established early customer relationships and pilots, and what’s needed now is a leader who can convert that early momentum into a repeatable, scalable new business engine — while building the internal alignment and best practices to sustain it.

This role is as much about internal leadership as external selling. You will partner closely with regional Sales, Technical Sales, and Portfolio Unit teams to surface opportunities, align on go-to-market strategies, and drive 3DIC growth.

Responsibilities
  • Own and lead the strategy to identify, develop, and close net-new 3DIC and advanced packaging business opportunities in partnership with regional Sales and Technical Sales leaders
  • Build repeatable approaches to opportunity development and closure — creating best practices for the broader team
  • Act as the primary connector across Sales, Technical Sales, and Portfolio Unit teams — building the alignment needed to move opportunities forward
  • Partner with Portfolio Unit and R&D teams to ensure field insights feed into product strategy and the field has what it needs to win
  • Support new business development for our Electronic Board Systems (EBS) business unit
  • Lead and develop a high-performing team of Account Technology Managers (ATMs), coaching on territory planning and new business growth
  • Define and manage sales territories annually, contributing to multi-year global growth plans for 3DIC
  • Partner with marketing to design and execute campaigns, seminars, and webinars that generate new 3DIC leads and build market awareness
Qualifications
  • Bachelor's degree in Electrical Engineering or Computer Science and 12+ years' experience in EDA, semiconductor design, or electronics industries
  • Deep knowledge of 3DIC and advanced packaging strongly preferred
  • Familiarity with Electronic Board Systems and the broader EDA landscape an advantage
  • Proven ability to build collaborative momentum across Sales, Technical Sales, and Portfolio teams in a matrixed environment
  • Track record of creating structure and best practices in ambiguous, fast-moving environments while delivering near-term results
  • Demonstrated success leading technical sales teams and converting emerging market opportunities into new business
  • Strong prospecting, demand creation, and negotiation skills
  • Executive-level communication and influencing skills, internally and externally
  • Comfortable operating with ambiguity and driving progress when the playbook is still being defined
Working Conditions
  • 30%+ travel required
  • Preferred location: North America, near a major airport

We’re dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need.

Salary: $274,700 $549,400 30%

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Director, Technical Business Development - 3DIC & Advanced Packaging
Senior Director, Technical Business Development - 3DIC & Advanced Packaging

Siemens AG • Boulder (CO)

Hybrid
USD 274,000 - 550,000
Flexible working options
Comprehensive benefits package
Senior Director, 3DIC Growth & Strategic Sales Leader
Senior Director, 3DIC Growth & Strategic Sales Leader

Siemens AG • Boulder (CO)

Hybrid
USD 274,000 - 550,000
Flexible working options
Comprehensive benefits package
Strategic Sales Leader for 3DIC & Advanced Packaging
Strategic Sales Leader for 3DIC & Advanced Packaging

Siemens EDA (Siemens Digital Industries Software) • Boulder (CO)

On-site
USD 274,000 - 550,000
Technical Marketing Engineer Advanced IC Packaging
Technical Marketing Engineer Advanced IC Packaging

Siemens EDA (Siemens Digital Industries Software) • Wilsonville (OR)

On-site
USD 110,000 - 170,000
Technical Marketing Engineer Advanced IC Packaging
Technical Marketing Engineer Advanced IC Packaging

Siemens AG • Wilsonville (OR)

Hybrid
USD 130,000 - 233,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Fremont (CA)

Hybrid
USD 120,000 - 180,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Austin (TX)

On-site
USD 90,000 - 150,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Wilsonville (OR)

On-site
USD 90,000 - 130,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • San Diego (TX)

On-site
USD 120,000 - 150,000
3D-IC Application Engineer
3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software) • Boulder (CO)

On-site
USD 110,000 - 150,000