Tech Marketing Engineer, 2.5D/3DIC Packaging Solutions

ISU Research Park

Ames, Northern (IA, KY)

Hybrid

USD 120,000 - 180,000

Full time

3 days ago

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Job summary

Siemens EDA is seeking a Technical Marketing Engineer in the United States to drive technical marketing and solution development for 2.5D and 3DIC design flows. You will translate customer use cases into workflows by connecting planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions, and articulating solution value.

The role requires collaboration with product, development, and field teams to shape future workflows and support global customers

Qualifications

Native or near-native English; strong communication skills.
5+ years in 2.5D/3DIC design or Advanced IC Packaging or related EDA flows.
Strong understanding of design workflows spanning planning, layout, and verification.
Proficiency with Tcl and Python to automate or integrate workflows across tools.

Responsibilities

Develop and deliver technical marketing materials for Advanced IC Packaging solutions (videos, presentations, lab/demo content).
Build and demonstrate solution workflows for 2.5D and 3DIC by connecting planning, layout, and verification tools using Tcl and Python.
Engage customers in technical discussions to understand design challenges and use-case requirements.
Translate customer requirements into actionable input for development teams.
Communicate technical value and applicability of products; stay aligned with future workflow directions.
Collaborate with product, development, and field teams to ensure solutions meet market needs.