Technical Marketing Engineer Advanced IC Packaging

ISU Research Park; Ames, Northern (IA, KY); Hybrid; USD 120,000 - 180,000; Full time

Job summary

Siemens EDA is seeking a Technical Marketing Engineer in the United States to drive technical marketing and solution development for 2.5D and 3DIC design flows. You will translate customer use cases into workflows by connecting planning, layout, and verification tools with Tcl and Python, engaging customers in technical discussions, and articulating solution value.

The role requires collaboration with product, development, and field teams to shape future workflows and support global customers

Qualifications

• Native or near-native English; strong communication skills.
• 5+ years in 2.5D/3DIC design or Advanced IC Packaging or related EDA flows.
• Strong understanding of design workflows spanning planning, layout, and verification.
• Proficiency with Tcl and Python to automate or integrate workflows across tools.

Responsibilities

• Develop and deliver technical marketing materials for Advanced IC Packaging solutions (videos, presentations, lab/demo content).
• Build and demonstrate solution workflows for 2.5D and 3DIC by connecting planning, layout, and verification tools using Tcl and Python.
• Engage customers in technical discussions to understand design challenges and use-case requirements.
• Translate customer requirements into actionable input for development teams.
• Communicate technical value and applicability of products; stay aligned with future workflow directions.
• Collaborate with product, development, and field teams to ensure solutions meet market needs.

Skills

English proficiency

2.5D/3DIC design

Tcl/Python scripting

Customer facing

Education

Electrical Engineering degree

Tools

Linux (end user)

Microsoft Office

Job description

Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Position Summary

The Technical Marketing Engineer is responsible for driving technical marketing and solution development for EBS-centered offerings in the area of Advanced IC Packaging , with particular focus on 2.5D and 3DIC design flows .

This role requires the ability to understand customer challenges and use cases, and to translate them into solution-oriented workflows by connecting planning, layout, and verification tools using scripting technologies such as Tcl and Python . The ideal candidate will be able to engage customers in technical discussions, articulate solution value, and help shape future workflow directions, including emerging approaches that may involve agent-based technologies .

Key Responsibilities

• Develop and deliver technical marketing materials such as videos, presentations, and lab/demo content for Advanced IC Packaging solutions.
• Build and demonstrate solution workflows for 2.5D and 3DIC design by connecting multiple tools, including planning, layout, and verification tools, using Tcl and Python .
• Engage customers in technical discussions to understand design challenges, workflow gaps, and use-case requirements.
• Translate customer technical requirements and related business needs into actionable input for development teams.
• Understand newly developed products and enhancement features, and communicate their technical value and applicability to customers.
• Support the definition and evolution of solution concepts that address current and future customer workflows.
• Collaborate with internal teams across product, development, and field organizations to align solutions with market needs.

Accountability / Expected Contributions

• Understand the goals of each assigned project and the role expected within that project.
• Proactively drive assigned responsibilities to support successful project execution and achievement of business objectives.
• Take ownership of deliverables and contribute effectively in project-based activities.
• Help identify and shape future solution opportunities based on customer engagement and market direction.

Required Qualifications

• Native or near-native proficiency in English .
• 5+ years of relevant experience in 2.5D / 3DIC design , Advanced IC Packaging , or technically supporting such flows from an EDA perspective.
• Strong understanding of design workflows spanning planning, layout, and verification .
• Practical scripting experience using Tcl and Python to automate or integrate workflows across multiple tools.
• Ability to engage directly with customers in technical discussions and help define solution use cases.
• Ability to use Linux as an end user in a business or technical environment.
• Proficiency in Microsoft Office products for business use.
• Formal academic background in Electrical Engineering, Electronics, or a related technical field .

Preferred Qualifications

• Experience in technical marketing, application engineering, solution engineering, or other customer-facing technical roles.
• Experience creating technical demonstrations, proof-of-concept workflows, or presentation materials.
• Familiarity with EDA solution positioning for semiconductor or packaging design customers.
• Interest in emerging workflow technologies, including AI- or agent-assisted solution approaches.

Travel Requirements

• Customer visits are required.
• Domestic travel will be the primary travel requirement.
• International travel may also be required occasionally.

Work Environment / Additional Considerations

This role requires collaboration with teams in Asia and Europe .

As a result, work may occasionally take place during early morning or evening hours to accommodate global collaboration.

This position will be subject to U.S. export control requirements under the International Traffic in Arms Regulations (ITAR) and/or Export Administration Regulations (EAR). Employment is contingent on either verifying the U.S. Person status or obtaining any necessary export license.