Substrate Packaging R&D Engineer - Hybrid Role

Intel Corporation; Phoenix (AZ); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Hybrid work model

Job summary

Intel Corporation's Packaging Module Development Engineer role focuses on advancing packaging processes and equipment to improve reliability, quality, and cost in high-volume manufacturing. You will design and optimize methods, run DOE studies to map process windows, and collaborate with cross-functional teams to deliver impactful packaging innovations for next-generation technology.

The position supports sustaining equipment performance, documents innovations, and operates within the SPDT

Qualifications

• PhD degree in materials science or engineering and 1+ year of related experience.
• 1+ year of experience combining engineering judgement, data analysis, and design of experiments.
• Materials science knowledge and material characterization techniques.
• DOE, statistical data analysis and SPC experience.

Responsibilities

• Develop and optimize advanced packaging processes, materials and equipment to meet targets.
• Design specifications, workflows, and equipment configurations for new technologies.
• Conduct DOE to characterize process windows and interactions.
• Drive continuous improvement for process capability, stability and productivity.
• Collaborate with cross-functional teams to resolve challenges and deliver solutions.
• Establish material specifications and coordinate with suppliers for quality.
• Document advancements through technical reports and white papers.
• Provide sustaining support for equipment performance in high-volume fabs.

Skills

DOE

Data analysis

Materials science

Statistical data analysis

Process development

Cross-functional collaboration

Education

PhD in Materials Science or related engineering

Job description

Intel Corporation's Packaging Module Development Engineer role focuses on advancing packaging processes and equipment to improve reliability, quality, and cost in high-volume manufacturing. You will design and optimize methods, run DOE studies to map process windows, and collaborate with cross-functional teams to deliver impactful packaging innovations for next-generation technology.

The position supports sustaining equipment performance, documents innovations, and operates within the SPDT