Substrate Packaging Research and Development Engineer

Intel Corporation; Phoenix (AZ); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Hybrid work model

Job summary

Intel Corporation's Packaging Module Development Engineer role focuses on advancing packaging processes and equipment to improve reliability, quality, and cost in high-volume manufacturing. You will design and optimize methods, run DOE studies to map process windows, and collaborate with cross-functional teams to deliver impactful packaging innovations for next-generation technology.

The position supports sustaining equipment performance, documents innovations, and operates within the SPDT

Qualifications

• PhD degree in materials science or engineering and 1+ year of related experience.
• 1+ year of experience combining engineering judgement, data analysis, and design of experiments.
• Materials science knowledge and material characterization techniques.
• DOE, statistical data analysis and SPC experience.

Responsibilities

• Develop and optimize advanced packaging processes, materials and equipment to meet targets.
• Design specifications, workflows, and equipment configurations for new technologies.
• Conduct DOE to characterize process windows and interactions.
• Drive continuous improvement for process capability, stability and productivity.
• Collaborate with cross-functional teams to resolve challenges and deliver solutions.
• Establish material specifications and coordinate with suppliers for quality.
• Document advancements through technical reports and white papers.
• Provide sustaining support for equipment performance in high-volume fabs.

Skills

DOE

Data analysis

Materials science

Statistical data analysis

Process development

Cross-functional collaboration

Education

PhD in Materials Science or related engineering

Job description

Job Details:

Job Description:

As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging technologies, directly contributing to the company's success in the semiconductor industry.

Business group

This position is part of Intel Corporation's Substrate Packaging Technology Development (SPTD) organization, which drives advancements in substrate packaging to support Intel's global technology leadership. The group focuses on delivering next-generation solutions for high-performance and mobile computing applications, enabling heterogeneous integration and die disaggregation across Intel's product portfolio.

Key Responsibilities

• Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.
• Design and implement process specifications, workflows, and equipment configurations for new technologies.
• Conduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry.
• Drive continuous improvement efforts to enhance process capability, stability, and productivity.
• Collaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions.
• Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
• Document advancements and process innovations through technical reports and white papers.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.

Behavioral traits:

• Team Collaboration: Works effectively across cross-functional teams and builds strong partnerships.
• Comfort with Ambiguity: Thrives in undefined or evolving projects and takes initiative to create direction.
• Performs Under Pressure: Manages multiple priorities, tight deadlines, and technical challenges while remaining focused on results.
• Conflict Resolution: Handles disagreements professionally, using data and communication to align stakeholders and reach solutions.
• Ownership & Problem Solving: Takes accountability, proactively addresses issues, and drives innovative solutions to completion.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or other similar engineering degree and 1+years of related experience.
• 1+year of experience in: Combining engineering judgement and data analysis skills to draw conclusions, build models and design experiments.
• Materials science and engineering, and in material characterization techniques.
• Knowledge and experience in design of experiments (DOE), statistical data analysis and statistical process control (SPC).

Preferred Qualifications

• Working knowledge and/or prior experience in optics and lasers, laser micro‑machining and micro‑fabrication.

Become part of Intel's cutting‑edge technology development team, where your expertise and creativity will drive innovation and shape the future of semiconductor manufacturing.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.