Packaging Module Development Engineer

Intel; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Paid vacation

Job summary

Intel in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly processes and equipment for future packaging technologies. You will optimize manufacturing, develop DOE-based experiments, and document improvements.

The role requires onsite presence; a PhD with 1+ years in DOE/SPC and semiconductor packaging experience is preferred, along with programming skills in Python or MATLAB.

Qualifications

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or related field with 1+ years of experience.
• 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE) and Statistical Process Control (SPC).
• 1+ years of experience in semiconductor manufacturing, packaging, materials engineering, or related advanced technology environments.

Responsibilities

• Develop and optimize packaging processes and equipment.
• Apply DOE/SPC and data-driven problem solving for root cause analysis.
• Collaborate with cross-functional teams to ensure quality, reliability and manufacturability.

Skills

DOE

SPC

Data analysis

Education

PhD in Mechanical/Materials/Electrical/Physics/related

Tools

Python

MATLAB

JMP

Minitab

Job description

Job Details

The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Note: This role requires regular onsite presence to fulfil essential job responsibilities.

Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 1+ years of experience.
• 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE), Statistical Process Control (SPC), and data-driven problem solving, for technical root cause analysis.
• 1+ years of experience with process development, characterization, optimization, or qualification in semiconductor manufacturing, packaging, materials engineering, or related advanced technology environments.

Preferred Qualifications

• Experience using data analysis tools such as Python, MATLAB, JMP, Minitab, or equivalent software.
• Knowledge of reliability engineering principles, failure mechanisms, and accelerated stress testing methods.
• Minimum cumulative GPA of 3.5

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.