Advanced Packaging R&D Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 115,000 - 220,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking a Packaging Research and Development Engineer in Phoenix, AZ to drive process and material development for advanced substrate packaging technology. The role involves on-site floor work, supplier interaction, and cross-functional collaboration to scale heterogeneous integration.

The ideal candidate will have a strong background in engineering or science, with experience in semiconductor manufacturing or technology development and a willingness to travel (<5%).

Qualifications

• Bachelor’s/Master’s/PhD in engineering or science with relevant years of experience.
• Experience in semiconductor manufacturing or technology development.
• Strong communication and ability to work cross-functionally.

Responsibilities

• Define equipment configurations, process specs, and integrated flow for new tech.
• Plan DOEs to characterize process windows and interactions.
• Drive improvements in yield, quality, cost, and automation.
• Lead cross-functional teams supporting substrate technology development.

Education

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Chemical Engineering

Bachelor’s degree in Materials Science

Bachelor’s degree in Physics

Bachelor’s degree in Chemistry

Master’s degree in Mechanical Engineering

Master’s degree in Chemical Engineering

Master’s degree in Materials Science

Master’s degree in Physics

Master’s degree in Chemistry

PhD in Mechanical Engineering

PhD in Chemical Engineering

PhD in Materials Science

PhD in Physics

PhD in Chemistry

Tools

SPC PCS RFCs

Statistical DOE

Process development

Data analysis ( JMP / JSL / Python )

Machine learning

Job description

Intel Corporation is seeking a Packaging Research and Development Engineer in Phoenix, AZ to drive process and material development for advanced substrate packaging technology. The role involves on-site floor work, supplier interaction, and cross-functional collaboration to scale heterogeneous integration.

The ideal candidate will have a strong background in engineering or science, with experience in semiconductor manufacturing or technology development and a willingness to travel (<5%).