Staff Process Engineer, APTD Bonding

Micron Technology; Boise (ID); On-site; USD 90,000 - 110,000; Full time

Benefits offered by this job

Comprehensive medical, dental, and vision plans

Robust paid time-off program

Paid family leave

Job summary

Micron Technology in Boise, Idaho is seeking a Process Engineer for the APTD Bonding team. This position focuses on optimizing processes to enhance product quality and reliability in semiconductor manufacturing.

The ideal candidate will have at least 5 years of experience in relevant fields and a BS degree in a technical discipline. Responsibilities entail developing new processes, resolving manufacturing issues, and ensuring compliance with engineering specifications. Micron offers comprehensive medical benefits and a supportive workplace environment.

Qualifications

• 5 years of relevant industry experience in semiconductor process engineering.
• Knowledge of Advanced Package Integration and memory products.
• Ability to resolve sophisticated issues through root-cause problem solving.

Responsibilities

• Develop and optimize processes for product quality and reliability.
• Identify, diagnose, and resolve assembly process-related problems.
• Coordinate and complete process evaluation and optimization initiatives.

Skills

Process yield improvement

Failure analysis

Statistical Process Control (SPC)

Data analysis

Education

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics

MS or PhD in a relevant engineering field

Job description

Our Vision

Our vision is to transform how the world uses information to enrich life for all.

About Micron Technology

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next‑generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

Position Overview

As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process‑related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods
• Identify, diagnose, and resolve assembly process related problems
• Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step
• Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction
• Support SPC/FDC/RMS/APC, and site-to-site portability
• Audit material suppliers to achieve quality, cost and risk management objectives

Minimum Qualifications

• BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis
• Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions
• Ability to resolve sophisticated issues through root‑cause or model‑based problem solving and adjust to shifting responsibilities and needs of the team

Preferred Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering
• Experience leading project teams and providing leadership updates

Benefits

Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.