SMTS Process Engineer RDA /Metrology

Micron Technology; Boise (ID); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to oversee chip-to-wafer and hybrid bonding processes. This role includes setting technical direction, leading multi-team efforts, and developing processes for high-performance 3D memory products. Candidates should possess a Master’s or PhD in a related field, with extensive semiconductor R&D and advanced packaging experience. Micron offers a comprehensive benefits package to support wellbeing and growth.

Qualifications

• 13+ years of semiconductor R&D experience, with 10+ years in advanced packaging.
• Ability to lead technical efforts without formal authority.
• Experience in guiding FOAK process or equipment development.

Responsibilities

• Set technical direction for chip-to-wafer and hybrid bonding processes.
• Develop process flows and materials meeting performance and cost needs.
• Lead problem solving across wafer fab and bonding interactions.
• Partner with teams to drive technology transfer into manufacturing.
• Ensure repeatability and high-volume readiness.

Skills

Leadership in multi-team technical efforts

Bonding process expertise

Problem-solving

Technical direction setting

Education

Master’s degree or PhD in related field

Job description

Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here!

This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost.

Responsibilities

• Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs
• Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs
• Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions
• Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs
• Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness

Minimum Qualifications

• Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field
• 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging
• Ability to lead multi‑team technical efforts and drive decisions without formal authority

Preferred Qualifications

• Experience leading FOAK process or equipment development under technical uncertainty
• Hands‑on work with equipment and materials suppliers shaping next‑generation capabilities
• Demonstrated technical leadership through mentoring, methodology development, patents, or publications
• Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding
• Strong understanding of process and package integration and cross‑module interactions

Micron offers a range of benefits to support your personal wellbeing and professional growth. You can choose from medical, dental and vision plans that fit your family’s healthcare needs and budget. Micron also provides programs that protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, we offer a robust paid time‑off program and paid holidays.

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.