Staff Process Engineer, APTD Bonding

Micron Technology, Inc.

Boise (ID)

On-site

USD 80,000 - 110,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical, dental and vision plans
Paid family leave
Paid time off
Paid holidays

Job summary

Micron Technology, Inc. is seeking a Process Engineer for the APTD Bonding team in Boise, Idaho. In this role, you will be focused on developing, optimizing, and troubleshooting processes to enhance product quality and reliability.

The ideal candidate will hold a BS in a relevant field and have at least 5 years of relevant experience in semiconductor process engineering. The position offers substantial benefits including medical, dental, and vision plans.

Qualifications

  • 5 years of relevant industry experience required.
  • Experience in semiconductor process engineering and packaging is essential.
  • Knowledge of DRAM, NAND, or other memory products is beneficial.

Responsibilities

  • Develop and optimize processes to improve product quality.
  • Resolve manufacturing line problems using FMEA or SPC methodology.
  • Coordinate process evaluations and implement changes.

Skills

Advanced package integration knowledge
Design of experiment techniques (DOE)
Statistical Process Control (SPC)
Root-cause problem solving
Data analysis skills

Education

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics

Job description

Position Overview

As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process‑related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities
  • Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods
  • Identify, diagnose, and resolve assembly process‑related problems
  • Coordinate and complete process, equipment, and material evaluation/optimization initiatives and implement changes at process step
  • Validate and fan‑out new process baseline qualified, including new process, tools, and/or materials for new product introduction
  • Support SPC/FDC/RMS/APC, and site‑to‑site portability
  • Audit material suppliers to achieve quality, cost and risk management objectives
Minimum Qualifications
  • BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience
  • Knowledge of advanced package integration and DRAM, NAND, or other memory products
  • Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis
  • Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions
  • Ability to resolve sophisticated issues through root‑cause or model‑based problem solving and adjust to shifting responsibilities and needs of the team
Preferred Qualifications
  • MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering
  • Experience leading project teams and providing leadership updates
Benefits

Micron offers medical, dental and vision plans, income protection, paid family leave, paid time off, and paid holidays. For more details, see the Benefits Guide.

Equal Opportunity & Right to Work

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Staff Process Engineer, APTD Bonding
Staff Process Engineer, APTD Bonding

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Staff Process Engineer, APTD Bonding
Staff Process Engineer, APTD Bonding

Micron Technology • Boise (ID)

On-site
USD 90,000 - 110,000
Comprehensive medical, dental, and vision plans
Robust paid time-off program
Paid family leave
Staff Process Engineer, APTD Bonding
Staff Process Engineer, APTD Bonding

Micron Technology, Inc • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
+1
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology, Inc. • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology • Boise (ID)

On-site
USD 100,000 - 140,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental, and vision plans
Paid family leave
Paid holidays
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental and vision plans
Paid family leave
Generous paid time off
Principal Die Bonding Process Engineer: Drive Yield
Principal Die Bonding Process Engineer: Drive Yield

Micron Technology, Inc. • Boise (ID)

On-site
Process Engineer
Process Engineer

Micron Technology • Manassas (VA)

On-site
USD 90,000 - 130,000
Medical, dental, vision plans
Paid time off & holidays
Paid family leave
SMTS Process Engineer RDA /Metrology
SMTS Process Engineer RDA /Metrology

Micron Technology • Boise (ID)

On-site
USD 130,000 - 160,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program