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Micron Technology, Inc. is seeking a Process Engineer for the APTD Bonding team in Boise, Idaho. In this role, you will be focused on developing, optimizing, and troubleshooting processes to enhance product quality and reliability.
The ideal candidate will hold a BS in a relevant field and have at least 5 years of relevant experience in semiconductor process engineering. The position offers substantial benefits including medical, dental, and vision plans.
As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process‑related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.
Micron offers medical, dental and vision plans, income protection, paid family leave, paid time off, and paid holidays. For more details, see the Benefits Guide.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable laws.
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