Principal Process Engineer, Die Bonding

Micron Technology; Boise (ID); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

Micron Technology in Boise, Idaho is seeking a Principal Process Engineer in Die Bonding. The role involves developing and optimizing semiconductor processes to enhance product quality and reliability. With emphasis on die bonding technologies, the position requires a minimum of 8 years of experience and a BS degree in Engineering. Preferred candidates may hold a Master's or Doctorate. Micron offers a comprehensive benefits package including healthcare, paid time-off, and professional growth opportunities.

Qualifications

• Minimum 8+ years proven experience in Semiconductor Process Engineering.
• Solid knowledge of advanced packaging die stacking processes.
• Skilled at designing valid tests and Data Analysis.

Responsibilities

• Develop, diagnose, and resolve die bonding process technologies.
• Coordinate process optimization initiatives.
• Lead yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Data Analysis

Project Management

Team Collaboration

Education

BS degree in Engineering

Master's or Doctorate preferred

Tools

Design of Experiments (DOE)

FMEA

SPC/FDC methodology

Job description

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron\'s leadership in the industry.

As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Lead and participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
• Support SPC/FDC/RMS/APC and site-to-site portability
• Support internal and external audits

Minimum Qualifications

• A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Skilled at designing valid tests and Design of Experiments (DOE)
• Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
• Excellent oral and written communication skills and a strong attention to detail
• Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
• Knowledge and an understanding of project management

Preferred Qualifications

• Masters or Doctorate degree in Engineering, Physics, or related field
• Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
• Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

Benefits and Compliance

Micron is dedicated to your personal wellbeing and professional growth. Benefits include a choice of medical, dental and vision plans in all locations enabling team members to select plans that meet their family healthcare needs and budget. Micron provides benefit programs to protect income if you are unable to work due to illness or injury, and paid family leave, along with a robust paid time-off program and paid holidays. For additional information regarding the Benefits Program available, see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable laws.

To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers. For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3).

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for employment. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate\'s true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website.