Staff Package Design Engineer – Advanced IC Packaging

Renesas; Arizona; On-site; USD 120,000 - 180,000; Full time

Job summary

Renesas is seeking a Staff Package Design Engineer to work at the intersection of IC design and advanced package development, delivering high-performance package solutions for automotive SoCs and IoT platforms.

You will lead package layout, CAD database management, and co-design with global teams, ensuring DRC/LVS compliance and manufacturability, with strong emphasis on cross-domain collaboration.

Qualifications

• Hands-on experience in package CAD layout.
• Experience with power module packaging and multi-die architectures.
• Familiarity with DFM/DFMA and manufacturing release standards.
• Experience interfacing with OSATs and foundries.

Responsibilities

• Execute package layout design for advanced package technologies.
• Develop and maintain package CAD databases supporting manufacturability.
• Manage package design cycle including Gerber data and drawings.
• Create substrate and RDL layouts, bump maps, and power/ground routing.
• Collaborate with SI/PI, thermal, reliability, DFT, silicon design, and manufacturing teams.
• Ensure designs comply with DRC/LVS and vendor constraints.
• Support ECO cycles and release documentation.

Skills

Package CAD layout

Substrate design

Advanced package development

Power module packaging

OSAT collaboration

Education

Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or related

Tools

Cadence Allegro Package Designer

Siemens Xpedition Substrate Integrator

Job description

Renesas is seeking a Staff Package Design Engineer to work at the intersection of IC design and advanced package development, delivering high-performance package solutions for automotive SoCs and IoT platforms.

You will lead package layout, CAD database management, and co-design with global teams, ensuring DRC/LVS compliance and manufacturability, with strong emphasis on cross-domain collaboration.