Senior Package Design Engineer - Power & Chiplet Packages

Renesas; Tempe (AZ); On-site; USD 120,000 - 170,000; Full time

Job summary

Renesas is seeking a Staff Package Design Engineer to join the Advanced Silicon Packaging team in Austin, TX or Tempe, AZ. You will design and deliver high-performance semiconductor package solutions, including power modules and chiplet-based architectures for automotive, industrial, IoT, and AI-enabled platforms.

The role requires deep expertise in package layout, manufacturability, assembly constraints, and cross-domain co-design with global teams.

Qualifications

• 4+ years hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
• Strong background in power module packaging, FCBGA, SiP, WLCSP, and multi-die/chiplet architectures.

Responsibilities

• Execute package layout design for advanced technologies including power modules, FCBGA, SiP, WLCSP, and multi-die modules.
• Maintain package CAD databases ensuring accuracy, manufacturability, and reliability.
• Manage the package design cycle: schematic, netlist import, footprint, layout, verification, Gerber/drill data, fabrication and assembly drawings.
• Create/modify substrate and RDL layouts, bump maps, escape routing, stack-up, and power/ground distribution features.
• Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams.
• Ensure designs comply with foundry, OSAT, substrate vendor rules including DRC/LVS and netlist verification.
• Support ECO cycles, revisions, and release documentation.

Skills

Package CAD layout

Power module packaging

Chiplet architectures

SI/PI & high-speed routing

Technical documentation

Education

Bachelors/Master's in Electrical Engineering or Microelectronics

Tools

Cadence Allegro Package Designer / SiP Layout

Siemens Xpedition Substrate Integrator

Job description

Renesas is seeking a Staff Package Design Engineer to join the Advanced Silicon Packaging team in Austin, TX or Tempe, AZ. You will design and deliver high-performance semiconductor package solutions, including power modules and chiplet-based architectures for automotive, industrial, IoT, and AI-enabled platforms.

The role requires deep expertise in package layout, manufacturability, assembly constraints, and cross-domain co-design with global teams.