Staff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind

Micron; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Job summary

Micron Technology seeks an experienced R&D engineer to advance wafer edge trim, backgrind and thinning processes for next-gen memory products. You will collaborate with process integration and adjacent areas to meet performance and yield targets, while solving complex mechanical and material challenges.

The role emphasizes experimental design (DOE), data analysis, and scalable solutions with strong ownership and independent work ability.

Qualifications

• BS or MS degree in engineering with 4+ years in wafer edge trim or related processing.
• Hands-on R&D capability with DOE, data analysis, and interpretation.
• Proven root-cause analysis with ability to drive improvements.

Responsibilities

• Develop and optimize wafer edge trim, backgrind, and thinning processes.
• Improve yield, cost efficiency, and wafer integrity via data-driven optimization.
• Conduct root-cause analyses for edge chipping, micro-cracks, warpage, and related issues.
• Provide early-stage pathfinding for ultra-thin wafer processing.
• Support transfer to production; some travel may be required.

Skills

DOE

Data analysis

Root-cause analysis

Experimentation

Problem solving

Project management

Independent work

Communication

Education

BS or MS in Engineering

PhD in related field

Tools

MS Office

Data visualization tools

Python (data analysis)

Job description

Micron Technology seeks an experienced R&D engineer to advance wafer edge trim, backgrind and thinning processes for next-gen memory products. You will collaborate with process integration and adjacent areas to meet performance and yield targets, while solving complex mechanical and material challenges.

The role emphasizes experimental design (DOE), data analysis, and scalable solutions with strong ownership and independent work ability.