Staff Engineer - Dry Etch R&D for AI Packaging

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Job summary

Micron Technology in Boise, Idaho seeks a Senior/Staff Engineer for the Dry Etch R&D team. You will develop and optimize plasma-based etch processes for next-generation packaging, collaborating across process, integration, and manufacturing to drive performance and yield.

You will apply structured experimentation, first-principles reasoning, and data analytics to complex process challenges, with opportunities to influence technology roadmaps and enable high-volume production.

Qualifications

• Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering or related field with 5+ years of relevant dry etch experience OR Master’s/PhD with 3+ years of relevant dry etch experience.
• Hands-on R&D experience advancing process performance through structured experimentation.
• Proven ability to apply DOE, data analysis, and first-principles reasoning to complex process problems.

Responsibilities

• Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products.
• Drive process capability, cost, and variability improvements using data-driven experimentation and equipment innovation.
• Collaborate with process integration and adjacent processes including Wet Etch, Films, Lithography, CMP, Wafer Trim and Bonding.

Skills

Dry etch

DOE

Data analysis

First-principles reasoning

R&D

Education

Bachelor’s degree in related field

Master’s or PhD in related discipline

Tools

Python

Data automation

GenAI-enabled analysis

Job description

Micron Technology in Boise, Idaho seeks a Senior/Staff Engineer for the Dry Etch R&D team. You will develop and optimize plasma-based etch processes for next-generation packaging, collaborating across process, integration, and manufacturing to drive performance and yield.

You will apply structured experimentation, first-principles reasoning, and data analytics to complex process challenges, with opportunities to influence technology roadmaps and enable high-volume production.