SI/PI Engineer: 2.5D/3D Packaging for ML ASICs

Annapurna Labs (U.S.) Inc.; Austin (TX); On-site; USD 130,000 - 185,000; Full time

Job summary

Annapurna Labs, an organization within Amazon, seeks a Signal or Power Integrity Engineer to join our hardware team in Austin, TX. You will perform package-level SI/PI analyses for advanced 2.5D/3D-IC packaging and collaborate with die and board teams to optimize performance and reliability.

You will build models, run high-speed simulations, and help decisions across IC, package, and board boundaries. Strong EM experience and packaging knowledge are essential for success.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of experience in signal integrity, power integrity, or package design.
• Solid understanding of SI or PI with working awareness of the other.
• Experience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity, ADS.
• Understanding of advanced packaging technologies: 2.5D/3D-IC, interposers, RDL, TSVs.

Responsibilities

• Perform package-level SI or PI simulations for 2.5D, 3D-IC, fan-out, and interposers.
• Support package stack-up design: dielectric evaluation, impedance control, layer assignment, RDL routing.
• Run high-speed channel simulations (S-parameters, time-domain, eye diagrams) for interfaces.
• Model advanced interconnects: microbumps, TSVs, microvias, RDL traces for signal or power paths.
• Build/validate models for decoupling technologies like on-die capacitance, DTCs, IPD capacitors.
• Coordinate with SoC die-level and board design teams to co-optimize package architecture.
• Flag packaging risks (warpage, via reliability, impedance variation) and propose mitigations.

Skills

Signal integrity

Power integrity

Package design

EM simulation

S-parameter extraction

Crosstalk

Return loss

Channel analysis

2.5D/3D-IC packaging

Interposers

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

Tools

HFSS

Cadence Sigrity (PowerSI, PowerDC, Clarity)

ADS

Job description

Annapurna Labs, an organization within Amazon, seeks a Signal or Power Integrity Engineer to join our hardware team in Austin, TX. You will perform package-level SI/PI analyses for advanced 2.5D/3D-IC packaging and collaborate with die and board teams to optimize performance and reliability.

You will build models, run high-speed simulations, and help decisions across IC, package, and board boundaries. Strong EM experience and packaging knowledge are essential for success.